An electroplating method and device for preparing an array micro-nano structure on the surface of a plated metal

Abstract

The invention discloses an electroplating method and device for preparing an array micro / nanostructure on a coated metal surface. An electroplating solution inlet and an electroplating solution outlet of an electroplating solution flowing channel are respectively provided with an anode; and the upper side of the electroplating solution flowing channel is provided with a template mounting station for placing a film template of the micro / nanostructure, and the lower side of the electroplating solution flowing channel is provided with a substrate mounting station for mounting a substrate. Due to the adoption of the unique electroplating solution flowing channel in the structure and controllable control on the flow rate and current of an electroplating solution in the channel, the quality of an electroplating process can be greatly improved; and by combining the electroplating method, the technical means of the whole electroplating process are simple, convenient and easy, the time and labor are saved, the cost is low, the electroplating method is suitable for a flexible template, the shape of a self-adaptive curve can be designed according to the shape of a base material, and a coating with the array micro / nanostructure can be prepared on a planar or curved surface. The preparation integration of the coating and the surface structure thereof is realized, and secondary structure preparation of the coating is not needed.

Description

Technical field [0001] The invention relates to an electroplating process and a device thereof, in particular to an electroplating method and device for preparing an array micro-nano structure on a plated metal surface. Background technique [0002] As the society's demand for technological innovation grows, the metal and non-metal electroplating technology that used to be mainly used for decorative products has now become an important functional coating and precision electroplating technology. [0003] Especially in the semiconductor microelectronics industry, it is widely used, and as semiconductor integrated circuits develop towards high density, light and miniaturization, various new functional electroplating technologies will continue to emerge. [0004] However, the current mature electroplating process can only achieve the compactness and surface smoothness of the coating, and it is not possible to directly control the current, electroplating solution, etc. to directly prepare...

AI Technical Summary

Problems solved by technology

[0004] However, the current mature electroplating process can only achieve the compactness and surface smoothness of the coating, and fails to directly prepare array micro-nano structures on the surface of the coating metal by directly controlling the current and electroplating solution.

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