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Radiator for CPU

A radiator and consistent technology, applied in the field of heat transfer, can solve the problems of inconvenient product processing, impact on heat dissipation efficiency, and high price, and achieve the effect of simple structure, good heat dissipation effect, and low specific gravity

Inactive Publication Date: 2015-06-03
陈伟峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat pipe radiator is a radiator with high heat dissipation efficiency and good cooling effect, but its strict manufacturing process determines that it is impossible to achieve low cost and expensive, which is a burden for low-end mass users
Aluminum-fin air-cooled radiator is a popular radiator, and it has no problem dealing with the overclocking of primary processors. Because of its cheap price, it has become the first choice in the middle and low-end radiator market. However, aluminum-fin radiators are limited by solid metal structures. , the thermal resistance is large, and the heat dissipation efficiency is affected to a certain extent, and the processing from the profile to the product is relatively trouble-free

Method used

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  • Radiator for CPU

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Embodiment Construction

[0007] The present invention will be further described below in conjunction with accompanying drawing.

[0008] Such as figure 1 As shown, the heat conduction plate (1) is a square aluminum plate, and the heat conduction plate (1) is provided with foamed aluminum (2), and the foamed aluminum (2) is a cubic porous aluminum foam metal material, and the size of the bottom surface of the foamed aluminum (2) is the same as The heat conduction plate (1) has the same square size; the heat conduction plate (1) and the foamed aluminum (2) are welded into one body.

[0009] The working principle of the present invention: when the heat sink for CPU provided by the present invention is in use, in order to reduce the thermal resistance, an appropriate amount of heat-conducting silicon grease is applied on the contact surface between the heat conducting plate (1) and the CPU, and the bottom surface of the heat sink is directly The central position of the CPU is placed on the CPU, and the r...

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Abstract

The invention provides a radiator for a CPU. The radiator for the CPU comprises a heat conducting plate (1) and foamed aluminum (2) and is characterized in that the foamed aluminum (2) is a cubic porous foamed aluminum metal material. The radiator for the CPU is low in material density, large in specific surface area, high in porosity, good in air permeability, good in heat dissipation capacity, high in heat dissipation efficiency, light in weight, simple in structure and easy to manufacture.

Description

technical field [0001] The invention relates to the field of heat transfer, in particular to a radiator for CPU. Background technique [0002] Common CPU radiators on the market include water-cooled radiators, heat pipe radiators and aluminum-fin air-cooled radiators. Water-cooled radiators and heat pipe radiators are two types of radiators with better effects among CPU radiators. However, water-cooled radiators are bulky, have a large support system, and are troublesome to install. If there is water leakage, it will threaten the life of the system. The price is not low. The heat pipe radiator is a radiator with high heat dissipation efficiency and good cooling effect, but its strict manufacturing process determines that it cannot achieve low cost and is expensive, which is a burden for low-end and low-end mass users. Aluminum-fin air-cooled radiator is a popular radiator, and it has no problem dealing with the overclocking of primary processors. Because of its cheap price...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 陈伟峰
Owner 陈伟峰
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