Heat Dissipation Mechanism of Universal Power Module

Abstract

A heat dissipation mechanism for a general power module. A heat dissipation main body (2) comprises a base (2-8), a top plate (2-3) and a closure plate (2-4) that form a cooling chamber. The closure plate (2-4) is fixed on an inner side between the base (2-8) and the top plate (2-3). At least two separation plates (2-7) are fixed between the base (2-8), the top plate (2-3) and the closure plate (2-4), so as to divide the cooling space into more than two independent cooling chambers. Lower pipe joints (2-10) separately communicating with the corresponding cooling chambers thereof are disposed at the lower part of the base (2-8), and upper pipe joints (2-1) separately communicating with the cooling chambers thereof are disposed on the upper part of the top plate (2-3). The front part of each of the cooling chambers is provided with a mounting surface (2-11) of the heat dissipation main body (2). A first power module (1) and / or a switching board (5) are / is mounted on the corresponding mounting surface (2-11) in a sealed manner. A second power module (6) is mounted on the switching board (5) in a sealed manner. The heat dissipation mechanism is convenient and flexible in use, allows mounting different power modules in a centralized manner, dissipates heat of the power modules in the centralized manner, and has a stable heat dissipation effect, and can be adapted to the development trends of generalization, centralization and diversification of the power modules.

Description

technical field [0001] The invention relates to a heat dissipation mechanism of a general-purpose power module, which belongs to the technical field of power modules. Background technique [0002] Semiconductor power modules mainly include copper substrates, metal-ceramic substrates, semiconductor chips, electrode terminals and housings. During the working process of the semiconductor power module, the heat generated by the semiconductor chip can pass through the copper substrate and be transferred to the heat sink below it to dissipate the heat in the semiconductor chip. However, with the development of technology, the power of power devices is getting higher and higher, and the power consumption of semiconductor chips is also gradually increasing. Often, the heat generated by semiconductor chips is also increasing. Therefore, it is necessary to dissipate the heat of semiconductor chips in time. At present, the installation space of the power module in the subsequent seque...

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Problems solved by technology

[0003] At present, the heat dissipation mechanism of the power module adopts a conventional finned heat sink, and the heat sink is connected to the bottom of the copper substrate. On the one hand, the height of the heat sink is high, so the installation height of the power device will be increased, making the volume smaller. Large, for some small installation space, it is not applicable

Especially when users need to combine multiple standard power modules, they need to design a larger size radiator to place multiple power modules separately, which not only takes up a lot of space, but also limits the application of the power module.

Another structural heat dissipation mechanism is to combine a fan and a heat sink, but this structural heat dissipation mechanism is also aimed at a single power module, which not only needs to occupy a large space, but also cannot adapt to the generalization, centralization, and diversity of power modules. development trend

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