Preparation method of high-density copper-clad circuit board

Abstract

The invention provides a preparation method of a high-density copper-clad circuit board. The preparation method comprises at least the steps of preparing a mold, providing a circuit board substrate, forming a molded layer on the circuit board substrate, forming molded layer patterns matched with the patterns of the mold in the molded layer by use of the mold, forming copper metal patterns the same as the mold patterns of the mold in the molded layer patterns, and transferring the mold patterns to the metal layer of the circuit board substrate from the mold by use of the copper metal patterns to form a conducting circuit to be prepared for the high-density copper-clad circuit board, wherein the mold patterns the same as the patterns of the conducting circuit to be prepared for the high-density copper-clad circuit board are formed on the surface of the mold; the metal layer is formed on the surface of the circuit board substrate. The preparation method is capable of hair-stripe conducting circuit patterns having the line width and the line pitch within the range of 2 to 50 microns; the high-density copper-clad circuit board prepared by the of the method has the advantages that the wiring area can be greatly reduced and the wiring density can be improved.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a method for preparing a high-density copper-clad circuit board. Background technique [0002] In the existing circuit board preparation process, when forming graphics, the main method adopted is to cover a photosensitive film (commonly known as "dry film") on a copper-clad rigid or flexible substrate, and then after exposure and development, the film sheet (also known as "dry film") That is, the pattern on the mask plate) is transferred to the dry film. Then use the dry film pattern to etch the underlying copper layer to form conductive lines. However, this method can only prepare conductive circuit patterns with a line width and line spacing greater than 100 μm, but cannot prepare thin line circuits, because it is mainly limited by two factors: one is that the film sheet cannot prepare thin lines, and the other is the dry film. The resolution is also not up ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for preparing a high-density copper-clad circuit board, which is used to solve the problem that the method of pasting dry film and film exposure in the prior art cannot prepare thin line circuits, And the method of using spin-coated photoresist and quartz mask is relatively expensive and cannot be produced roll-to-roll

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