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Device, method, bus structure and system for dealing with bus hanging

A processing system and bus technology, applied in the field of system-on-chip, can solve problems such as data errors and system operation errors, and achieve the effect of enhancing stability and improving user experience

Active Publication Date: 2019-01-25
RDA CHONGQING MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] But the problem with this patent is that forcibly generating a handshake signal can only keep the bus from hanging up, but the data obtained by the CPU or other master devices is still wrong, so the system has run wrong and needs to be restarted
At the same time, the method disclosed in this patent has no on-site storage mechanism, so that the CPU cannot judge the cause of the hangup, so this method still cannot fundamentally solve the stability problem of the system

Method used

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  • Device, method, bus structure and system for dealing with bus hanging
  • Device, method, bus structure and system for dealing with bus hanging
  • Device, method, bus structure and system for dealing with bus hanging

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Embodiment Construction

[0038]Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. In the drawings, the thickness of regions and layers are exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0039] The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the invention. However, one skilled in the art will appreciate that the technical solutio...

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Abstract

The invention provides a device, method, bus structure and system for dealing with hang-up death of buses. The device comprises a bus monitoring module, the fourth bus, a bus switching module and a bus retransmission module, wherein the bus monitoring module is configured to receive control information, data and hand shaking signals transmitted on the first bus used for communication between at least one master device and at least one slave device, the bus monitoring module sends the control information and the data and is used for storage, and the bus monitoring module monitors the state of the first bus and judges whether the first bus is in the hang-up death state or not; the fourth bus is used for data retransmission after the first bus is in the hang-up death state; the bus switching module is connected with the second bus, the third bus and the fourth bus and used for switching the second bus and the fourth bus; the bus retransmission module is used for performing data retransmission through the fourth bus after the bus switching module completes bus switching.

Description

technical field [0001] The invention relates to a system on chip (SoC), in particular to a method, a device, a bus structure and a system for dealing with bus hanging in the SoC. Background technique [0002] The bus (Bus) in the System on Chip (SoC, System on Chip) and Application Specific Integrated Circuit (ASIC, Application Specific Integrated Circuit) is the bridge for all data mutual transmission, which is directly related to the stability of the SOC system. [0003] There are many kinds of SoC bus transmission protocols, and these transmission protocols have a common feature that the master (Master) and slave (Slave) devices use handshake signals to correctly transmit data. Figure 1A and 1B It is an interactive flow chart of data transmission between the master and slave devices through handshaking signals in the prior art. Such as Figure 1A and 1B As shown, most of the bus transmission can be divided into two parts, the command transmission handshake phase and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/38G06F13/40
Inventor 高峰
Owner RDA CHONGQING MICROELECTRONICS TECH CO LTD