Full-automatic crystal feeding adhesive application device
A fully automatic, crystal technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low efficiency and easily damaged chips, and achieve the effect of improving production efficiency and product qualification rate
Active Publication Date: 2015-06-17
安庆友仁电子有限公司
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Problems solved by technology
This process requires high precision, and it is usually operated manually. Due to the existence of manual differences, it is easy to damage the wafer, and the efficiency is low.
Method used
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[0020] Referring to the accompanying drawings, the crystal automatic feeding viscose equipment includes a fixed table 1, a hexagonal sheave 2 and a drive motor 3, and the lower end of the hexagonal sheave 2 is connected to the drive motor 3 through a transmission mechanism. The positions are respectively provided with clamping devices 21, and the clamping devices 21 are composed of a fixed plate 211, a fixed groove 212 and a pair of splints 213 that cooperate with each other. The fixed plate 211 is slidably arranged on the fixed groove 212, and one of the pair of clamps The clamping plate is fixed on one end of the fixing plate, and the other clamping plate is fixed on the fixing groove 212. The other end of the fixing plate 211 is provided with a fixed shaft 214. The other end is connected with a return spring 216, and the other end of the return spring 216 is arranged on the plywood, and the front end of a pair of plywood 213 has a material clamping groove 2131; at the corres...
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The invention discloses a full-automatic crystal feeding adhesive application device which comprises a fixed table, a hexagonal sheave and a driving motor. The lower end of the hexagonal sheave is connected with the driving motor through a transmission mechanism. The six corners of the hexagonal sheave are each provided with a clamping device. A feeding device, a correcting device, a wafer suction and insertion device, a wafer feeding detection device, an adhesive dispensing device and a taking device are distributed at the six corresponding corners respectively in an anticlockwise mode. A vibration disc feeding mechanism is in lap connection with the feeding device. An optical fiber amplifier is arranged at the feeding device. The wafer suction and insertion device sucks wafers placed on a wafer placement plate and then automatically inserts the wafers into a support, then automatic adhesive dispensing is carried out on the wafers through the adhesive dispensing device, and full-automatic control over the full-automatic crystal feeding adhesive application device is achieved through the feeding device, the correcting device, the wafer suction and insertion device, the wafer feeding detection device, the adhesive dispensing device and the taking device.
Description
technical field [0001] The invention relates to the technical field of precision product processing equipment, and specifically belongs to a fully automatic removing and inserting device for fixing a U-series wafer to a bracket. Background technique [0002] Quartz crystal is a resonant element made by utilizing the piezoelectric effect of quartz crystal. In the production of quartz wafers, it is necessary to silver-plate the processed quartz wafers and install them on the bracket, and conductive glue needs to be applied between the wafers and the pins. This process requires high precision, and it is usually operated manually. Due to the existence of manual differences, it is easy to damage the wafer, and the efficiency is low. Contents of the invention [0003] In view of the problems referred to above, the purpose of the present invention is to provide crystal automatic material feeding viscose equipment, which overcomes the deficiencies in the prior art and is simple i...
Claims
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Inventor 项涛敬文平项武
Owner 安庆友仁电子有限公司