Method for producing structured microcarriers
A microcarrier and three-dimensional structure technology, applied in the field of microcarriers, can solve the problems of disrupting the uniform distribution, disrupting the uniformity of the fluid velocity, affecting the reliability of the assay, and achieving the effect of facilitating processing and enhancing mechanical properties.
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[0065] will refer to Figures 6 to 17 A method for producing microcarriers according to the invention is described. The method comprises the following sequential steps.
[0066] like Image 6 As shown, the first step involves providing a wafer 15 having a sandwich structure comprising a bottom layer 16, a top layer 17 and an insulating layer 18 between the bottom and top layers 16,17.
[0067] For example, the wafer 15 is an SOI (silicon on insulator) wafer with a diameter of 100 mm, a bottom layer 16 of 380 μm thickness, an insulating layer 18 of 1 μm thickness and a top layer 17 of 10 μm thickness. The top layer 17 and the bottom layer 16 are made of single crystal silicon, and the insulating layer 18 is made of silicon dioxide.
[0068] The method according to the invention further comprises the step of structuring the top layer 17 to define a three-dimensional structure on the top surface 19 of the top layer 17 .
[0069] For this purpose, the second step involves appl...
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