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Resin composition and prepreg and laminate using the same

A technology of resin composition and mixture, applied in the field of prepreg, laminate and printed circuit board, resin composition, can solve the problems of low water absorption, high high temperature retention rate of elastic modulus, large expansion coefficient, etc. Good heat and humidity resistance, improved humidity and heat resistance, and high temperature retention

Active Publication Date: 2017-11-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, one of the purposes of the present invention is to provide a resin composition, which uses BOZ and amine-modified BMI to further react, and well exerts the performance advantages of the two high-performance resins of BMI / BOZ, overcoming the existing A series of problems in the application of BMI in the field of copper clad laminates, such as the high cost of the BT system, high technical difficulty or harsh curing conditions for the allyl-modified BMI system, or the existing BOZ / epoxy (EP) system, do not use The amount of BMI or BMI is small, the Tg is low, the mechanical properties are insufficient, the expansion coefficient is relatively large, and the dielectric properties are relatively high, so that the obtained resin composition has high Tg, high peel strength and elastic modulus. High temperature retention, low CTE, low water absorption, low dielectric loss, good heat resistance, heat resistance and flame retardancy, etc.

Method used

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  • Resin composition and prepreg and laminate using the same
  • Resin composition and prepreg and laminate using the same
  • Resin composition and prepreg and laminate using the same

Examples

Experimental program
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preparation example Construction

[0059] (2) Preparation of resin composition

[0060] Add benzoxazine resin, optional epoxy resin, optional toughening agent, optional curing agent, optional curing accelerator and solvent into a beaker of appropriate capacity in sequence, and stir at high speed to dissolve for 30-60 After dissolving, add amine-modified BMI, optional flame retardant and optional filler, stir for 2 hours to mature, and the solid content and solution viscosity of the resin composition are adjusted by the amount of solvent.

[0061] (3) Production of prepreg

[0062] The prepreg is made by heating and drying the above-mentioned resin composition, and it uses non-woven fabric or other fabrics as the base material, such as natural fibers, organic synthetic fibers and inorganic fibers. Use the above-mentioned resin composition, pre-impregnated fabrics such as glass cloth or organic fabrics, and finally pass the glass cloth through the nip shaft of rolling to remove part of the liquid resin, control ...

Embodiment 1

[0066] (1) Preparation of amine-modified BMI

[0067] Diaminodiphenylmethane (DDM) to 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide (BMI) B239 by weight Feed at 1:10 (molar ratio is about 1:4.5), add it into a three-necked flask, then add an appropriate amount of dimethylacetamide (DMAc) solvent to stir and disperse, blow nitrogen, gradually increase the temperature while stirring to further dissolve, and put The temperature is kept at 100-115 degrees, refluxed for 2-4 hours, and then cooled to obtain a DDM-modified BMI, and the solid content of the DDM-modified BMI solution is controlled to 60% by the amount of solvent used.

[0068] (2) Preparation of resin composition

[0069] Feeding according to the material dosage ratio (solid weight) in Table 1 (except for the solvent, it refers to the solid dosage, including DDM modified B239), the specific preparation method is: add DDM modified B23928 parts, D12515 parts, PS to a 1000ml beaker in turn -63135 parts, N...

Embodiment 2

[0075] Example 2, Example 3 and Example 4 were prepared by repeating Example 1 respectively, the main difference being that the epoxy resin was respectively replaced by HP-7200H, NC-7300L, EPR627, wherein Example 2 and Example 4 also added XZ -92741, the preparation of other steps is substantially the same as in Implementation 1.

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Abstract

The invention belongs to the technical field of copper-clad laminates, and in particular relates to a resin composition and a prepreg and a laminated board using the resin composition. The resin composition comprises: 15-55% of amine-modified bismaleimide (BMI), 10-45% of benzoxazine resin and 0-75% of epoxy resin according to the weight percentage of each component. %. In the present invention, by further reacting benzoxazine (BOZ) with amine-modified bismaleimide (BMI), the performance advantages of the two high-performance resins of BMI / BOZ are brought into full play, so that the preformed Dipping materials and copper clad laminates have high Tg, high peel strength, low CTE, low water absorption, low dielectric loss, high elastic modulus high temperature retention, good heat and humidity resistance, etc. And reach the UL94‑V0 flame retardant level.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a resin composition and a prepreg, a laminate and a printed circuit board using the resin composition. Background technique [0002] BMI is currently widely used in BT copper clad laminates for high-end packaging, but BMI in BT resins generally cannot directly react with cyanate (CE) resins, requiring special manufacturing processes, which is very difficult. At present, the manufacturing and market supply of BT copper clad laminates in the world are mainly monopolized by a few Japanese companies. In addition, the cost of CE is high, and the supply of CE market with special structure is limited, which greatly limits the application and technology development of BMI, and also limits the packaging. Further development of technology and industry. [0003] BMI system copper clad laminates modified by allyl compounds such as allyl bisphenol A, due to the intr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L79/04C08L79/08B32B27/04B32B27/38B32B15/092B32B15/20H05K1/03
Inventor 陈振文
Owner GUANGDONG SHENGYI SCI TECH
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