Thermal treatment process for improving microscopic coarse grains and microstructures of H13 forged piece
A microstructure and process technology, which is applied in the field of heat treatment process to improve the low magnification coarse grain and microstructure of H13 forgings, can solve the problems affecting the service life of the die, mixed crystals, etc., so as to improve the cooling rate and eliminate the low magnification coarse grain. , Eliminate the effect of uniform microstructure
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0011] Embodiment one
[0012] Improve the heat treatment process of H13 forgings with low magnification coarse grain and microstructure, select the steel forgings as H13 (4Cr5MoSiV1), C is 0.38~0.43%, Si is 0.80~1.20%, Mn is 0.30~0.50%, Cr is 4.75% ~5.5%, Mo is 1.10~1.75%, S≤0.020%, P≤0.025%, and forgings with a specification of φ180, including the following processes (such as figure 1 shown):
[0013] Step 1: High-temperature diffusion heating: the first preheating temperature of high-temperature diffusion is 600-680°C, the heating rate is ≤80°C / h, the holding time is 1-1.2 hours / 100mm, the second preheating temperature is 800-870°C, heat The speed is ≤80°C / h, the holding time is 1-1.2 hours / 100mm, the high-temperature diffusion temperature is 1080-1150°C, and the holding time is 2-4h / 100mm;
[0014] Step 2: High-temperature diffusion cooling, after heat preservation, cool to 500-550°C at a rate of ≤30°C / h;
[0015] Step 3: put into the furnace for normalizing heating, th...
Embodiment 2
[0025] Improve the heat treatment process of low-magnification coarse grain and microstructure of H13 forgings, select steel forgings as H13, C is 0.38~0.43%, Si is 0.80~1.20%, Mn is 0.30~0.50%, Cr is 4.75~5.5% , Mo is 1.10~1.75%, S≤0.020%, P≤0.025%, and forgings with a specification of φ245, including the following processes (such as figure 1 shown):
[0026] Step 1: High-temperature diffusion heating: the first preheating temperature of high-temperature diffusion is 600-680°C, the heating rate is ≤80°C / h, the holding time is 1-1.2 hours / 100mm, the second preheating temperature is 800-870°C, heat The speed is ≤80°C / h, the holding time is 1-1.2 hours / 100mm, the high-temperature diffusion temperature is 1080-1150°C, and the holding time is 2-4h / 100mm;
[0027] Step 2: High-temperature diffusion cooling, after heat preservation, cool to 500-550°C at a rate of ≤30°C / h;
[0028] Step 3: put into the furnace for normalizing heating, the preheating temperature is 600-680°C, the he...
Embodiment 3
[0038]Improve the heat treatment process of low-magnification coarse grain and microstructure of H13 forgings, select steel forgings as H13, C is 0.38~0.43%, Si is 0.80~1.20%, Mn is 0.30~0.50%, Cr is 4.75~5.5% , Mo is 1.10~1.75%, S≤0.020%, P≤0.025%, and forgings with a specification of φ270, including the following processes (such as figure 1 shown):
[0039] Step 1: High-temperature diffusion heating: the first preheating temperature of high-temperature diffusion is 600-680°C, the heating rate is ≤80°C / h, the holding time is 1-1.2 hours / 100mm, the second preheating temperature is 800-870°C, heat The speed is ≤80°C / h, the holding time is 1-1.2 hours / 100mm, the high-temperature diffusion temperature is 1080-1150°C, and the holding time is 2-4h / 100mm;
[0040] Step 2: High-temperature diffusion cooling, after heat preservation, cool to 500-550°C at a rate of ≤30°C / h;
[0041] Step 3: put into the furnace for normalizing heating, the preheating temperature is 600-680°C, the hea...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com