Efficient and energy-saving EPT for rapidly forming metal pattern circuit

Abstract

The invention relates to an efficient and energy-saving EPT for rapidly forming a metal pattern circuit. The EPT is formed by the combination of a portable novel positioning printing machine table, a pattern circuit screen printing plate, environmentally friendly mask colloid and a PVD vacuum sputtering coating technology. In the using process, a substrate is placed on a positioning platform of the positioning printing machine table, and through calibration of a fine-adjustment platform, the pattern circuit screen printing plate is matched with the substrate; through a scraper, the environmentally friendly mask colloid on the screen printing plate evenly covers the surface of the region, unrelated with the pattern circuit, of the substrate and forms a film layer on the surface of the substrate through low-temperature solidification; through the PVD vacuum sputtering coating technology, a metal layer is formed on the region, not provided with the environmentally friendly mask colloid, of the surface of the substrate; because the adhesive force between the metal layer and the substrate is high, through soaking of a common water source, the environmentally friendly mask film layer will be softened and separated from the substrate, and the metal pattern circuit is formed on the surface of the substrate. In this way, the efficient and energy-saving EPT has the advantages of being simple in structure, high in efficiency, safe, reliable, high in practicability and environmentally friendly, saving energy and the like.

Description

technical field [0001] The invention relates to a high-efficiency, energy-saving EPT for fast-forming metal graphic circuits, which is mainly used in the electronics industry, PCB circuits, aluminum substrate circuits, TE substrate circuits, and the like. Background technique [0002] At present, with the rapid development of the electronic technology field, the demand for PCB circuits, aluminum substrate circuits, TE substrate circuits, etc. is increasing, and there are serious shortcomings in the process and technology: 1. The process is relatively complicated, involving more equipment and personnel, The general process sequence is as follows: micro-etching, water washing, drying, lamination, exposure, inner layer image development, etching, film removal, cleaning, drying, etc.; therefore, the cost is high, the environment is polluted, and it is not environmentally friendly; it seriously affects Human health, poor security and other shortcomings. Contents of the inventio...

AI Technical Summary

Problems solved by technology

[0002] At present, with the rapid development of the electronic technology field, the demand for PCB circuits, aluminum substrate circuits, TE substrate circuits, etc. is increasing, and there are serious shortcomings in the process and technology: 1. The process is relatively complicated, involving more equipment and personnel, The general process sequence is as follows: micro-etching, water washing, drying, lamination, exposure, inner layer image development, etching, film removal, cleaning, drying, etc.; therefore, the cost is high, the environment is polluted, and it is not environmentally friendly; it seriously affects Human health, poor safety and other shortcomings

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