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OLED substrate, manufacturing method, OLED panel and display device

A substrate and panel technology, which is applied in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc., can solve the problems of low lateral strength, affect the life of OLED panels, and deteriorate the sealing effect of OLED panels, so as to increase the lateral tensile strength Force, improve service life, increase the effect of transverse tensile strength

Inactive Publication Date: 2015-06-24
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In practice, the lateral strength between the glass glue 21 and the interlayer insulating layer 12 is small, which makes it difficult for the above-mentioned OLED panel to withstand a large lateral tensile force (that is, a force parallel to the substrate 10 and the glass layer 20). When it is larger, relative movement will occur between the OLED substrate 1 and the encapsulation substrate 2 in the above-mentioned OLED panel, which will lead to poor sealing effect of the OLED panel and affect the life of the OLED panel.

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  • OLED substrate, manufacturing method, OLED panel and display device
  • OLED substrate, manufacturing method, OLED panel and display device
  • OLED substrate, manufacturing method, OLED panel and display device

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Embodiment Construction

[0040] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

[0041] The present invention provides an embodiment of an OLED substrate, figure 2 A schematic diagram of a partial structure of an OLED substrate provided in an embodiment of the present invention. In this embodiment, as figure 2 As shown, an interlayer insulating layer 12 is formed on the edge of the OLED substrate 1 , and pits are formed on the surface of the interlayer insulating layer 12 .

[0042] Please also refer to figure 2 and image 3 The surface of the interlayer insulating layer 12 is provided with pits, so that when the OLED substrate 1 and the encapsulating substrate 2 are boxed and packaged, the interlayer insulating layer 12 and the glass glue 20 ...

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Abstract

The invention relates to an OLED substrate, a manufacturing method, an OLED panel and an OLED display device. An interlayer insulating layer is formed on the edge of the OLED substrate, and pits are formed in the surface of the interlayer insulating layer. As the pits are formed in the surface of the interlayer insulating layer of the OLED substrate, the transverse tensile strength between the interlayer insulating layer and a package substrate can be improved, namely the transverse tensile strength between the OLED substrate and the package substrate can be improved, the stability of the OLED panel is improved, the sealing effect on the OLED panel is ensured, and the service life of the OLED panel is prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED substrate and a preparation method, an OLED panel and an OLED display device. Background technique [0002] The sealing degree of the packaging of the OLED device directly affects the lifetime of the OLED device, therefore, it is an important indicator for evaluating the quality of the OLED device. [0003] figure 1 It is a schematic diagram of a partial structure of an existing OLED panel. like figure 1 As shown, the OLED panel is formed by a pair of OLED substrate 1 and packaging substrate 2 . The OLED substrate 1 includes a substrate 10, and a light-emitting structure prepared on the substrate 10 (including structures such as an anode layer, a cathode layer, and an organic functional layer); wherein, in the edge region of the OLED substrate 1, an interlayer insulating layer (ILD) is also provided. ) 12, the interlayer insulating layer 12 is located on the outermos...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/56H01L51/52H01L51/50
CPCY02E10/549H10K59/12H10K59/873H10K59/8722H10K50/84H10K50/844H10K50/8426H10K59/1213H10K77/10H10K59/1201
Inventor 敖宁白妮妮张朝波
Owner BOE TECH GRP CO LTD