Opening process for multi-layer ladder-shaped rigid-flex board

Abstract

The invention discloses an uncovering process for a multi-layer ladder-like soft and hard combination plate. The uncovering process comprises the following steps that 1, a, electroplating, graph manufacturing and coverage film laminating are sequentially carried out on a two-sided soft plate; b, one-sided soft plates are bonded to the two sides of the two-sided soft plate, and electroplating and graph manufacturing are sequentially carried out on the one-sided soft plates; 2, a CO2 laser cutting machine is adopted for carrying out grooving on preset regions of the one-sided soft plates, and then coverage films laminated in the step 1 are uncovered and exposed; 3, coverage films are laminated on the regions, grooved, uncovered and exposed in the step 2, of the one-sided soft plates; 4, protecting films are stacked and laminated on the coverage films; 5, copper foil and prepreg are stacked and laminated on the one-sided soft plates, and then plate arranging is carried out, so that a hard plate is formed; 6, a UV machine is adopted for cutting a hard plate region corresponding to the protecting films, and the protecting films and the hard plate region corresponding to the protecting films are uncovered to expose the coverage films. The uncovering process can avoid the layering defect and the base material residual defect in the glue overflowing and uncovering processes.

Description

technical field [0001] The invention relates to an uncovering process of a circuit board, in particular to an uncovering process for a multi-layer stepped soft-hard combination board. Background technique [0002] For multi-layer stepped flexible and rigid boards, such as a triple stepped structure containing 6L hard board, 4L and 2L soft board layers, which has 6 layers of boards, it needs to be opened in sections. Among them, in the circuit board industry , L refers to the layer, and opening the cover is also called uncovering; two-layer board / two-layer board refers to a soft board with two layers of copper foil, for example, a double-sided soft board is a two-layer soft board / two-layer board, a single-layer board The surface soft board is a one-layer soft board / one-layer board. The existing uncapping process such as figure 1 shown, press figure 1 During the production process of the shown process flow, the process and quality face the following problems: [0003] 1) L...

AI Technical Summary

Problems solved by technology

[0007] At the junction of 2L-4L, glue overflowed after opening the cover or the substrate residue was too large. The reason is that in order to avoid laser cutting the soft board, PI needs to retain a residual thickness of about 10um. This residual thickness will lead to failure when the cover is opened. Neatness leads to substrate residue or glue overflow

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