Manufacturing procedure of electronic substrate, manufacturing procedure of display panel and applied adhesive

Abstract

The invention provides a manufacturing procedure of an electronic substrate, a manufacturing procedure of a display panel and the applied adhesive. For the display panel, the manufacturing procedure comprises the steps of firstly preparing a first hard type substrate and a second hard type substrate coating liquid adhesives on surfaces then arranging dissolution removing agent on the adhesives so that adhesive dry films with adhesion ability are formed on the adhesives combining a first base material and a second base material by the adhesive dry films and the second substrate is combined to the second hard type substrate by the adhesive dry film. The formed two panel modules and display materials therebetween are adhered and laminated via frame glue so that a display panel is formed. Light is emitted on the display panel, so the adhesive dry films loose adhesion ability. Thus, the first hard type substrate and the second hard type substrate can be easily moved and the display panel can be formed.

Description

technical field [0001] The present invention relates to a manufacturing process of an electronic base material, a manufacturing process of a display panel and an applied adhesive, in particular to an electronic base material and a display panel manufacturing process using an adhesive with photosensitive properties, and an adhesive applied to this process . Background technique [0002] A rigid or flexible display panel is a multi-layer structure of laminated circuits, electrodes, and display materials. In the production process, in addition to the difficult handling and alignment of the substrate itself, there are also certain physical differences between the layers. Differences, for example, when each layer of material is heated, different phenomena will occur due to the difference in the specific heat of the structure and material on each layer, especially because of the problem of warping caused by different responses of each layer to temperature when heated or low temper...

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Problems solved by technology

[0006] In order to improve the problem of low process yield due to insufficient rigidity in the process of using substrates to make display panels, this specification discloses a manufacturing process for electronic substrates, a manufacturing process for display panels, and adhesives used. In addition to using rigid substrates as a manufacturing process In addition to the purpose of maintaining the rigidity of the entire structure and easy alignment, an adhesive dry film that can remove solvents to produce adhesiveness and lose adhesiveness when exposed to light can be used to smoothly handle hard substrates and various types of substrates during the manufacturing process. The steps of bonding and peeling between materials

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