Manufacturing procedure of electronic substrate, manufacturing procedure of display panel and applied adhesive

A technology for electronic substrates and display panels, applied in the field of adhesives used in this process, can solve the problem of low process yield

Active Publication Date: 2015-07-08
ZHEJIANG KUOSEN FINE CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to improve the problem of low process yield due to insufficient rigidity in the process of using substrates to make display panels, this specification discloses a manufacturing process for electronic substrates, a manufacturing process for display panels, and adhesives used. In addition to using rigid substrates as a manufacturing process In additi

Method used

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  • Manufacturing procedure of electronic substrate, manufacturing procedure of display panel and applied adhesive
  • Manufacturing procedure of electronic substrate, manufacturing procedure of display panel and applied adhesive
  • Manufacturing procedure of electronic substrate, manufacturing procedure of display panel and applied adhesive

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0037] The designated representative in this case is Figure 6 .

[0038] A brief description of the symbols in this representative diagram:

[0039] S601 equipped with hard substrate

[0040] S603 Coating liquid adhesive

[0041] S605 Form adhesive dry film

[0042] S607 adheres to the base material and forms two panel modules

[0043] S609 Combining two panel modules and the display material in them

[0044] S613 combined to form a display panel

[0045] S615 Irradiating light to remove adhesiveness

[0046] S617 Remove hard substrate and adhesive dry film

[0047] S619 forming display panel

[0048] The chemical formula that best shows the characteristics of the invention:

[0049]

[0050] This specification is about the manufacturing process of an electronic substrate, the manufacturing process of a display panel and the adhesive used. The adhesive used in the manufacturing process has photosensitive properties, and one of its properties is to remove solvents ...

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PUM

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Abstract

The invention provides a manufacturing procedure of an electronic substrate, a manufacturing procedure of a display panel and the applied adhesive. For the display panel, the manufacturing procedure comprises the steps of firstly preparing a first hard type substrate and a second hard type substrate coating liquid adhesives on surfaces then arranging dissolution removing agent on the adhesives so that adhesive dry films with adhesion ability are formed on the adhesives combining a first base material and a second base material by the adhesive dry films and the second substrate is combined to the second hard type substrate by the adhesive dry film. The formed two panel modules and display materials therebetween are adhered and laminated via frame glue so that a display panel is formed. Light is emitted on the display panel, so the adhesive dry films loose adhesion ability. Thus, the first hard type substrate and the second hard type substrate can be easily moved and the display panel can be formed.

Description

technical field [0001] The present invention relates to a manufacturing process of an electronic base material, a manufacturing process of a display panel and an applied adhesive, in particular to an electronic base material and a display panel manufacturing process using an adhesive with photosensitive properties, and an adhesive applied to this process . Background technique [0002] A rigid or flexible display panel is a multi-layer structure of laminated circuits, electrodes, and display materials. In the production process, in addition to the difficult handling and alignment of the substrate itself, there are also certain physical differences between the layers. Differences, for example, when each layer of material is heated, different phenomena will occur due to the difference in the specific heat of the structure and material on each layer, especially because of the problem of warping caused by different responses of each layer to temperature when heated or low temper...

Claims

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Application Information

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IPC IPC(8): G02F1/1333C09J125/16C09J133/08
CPCC09J125/16C09J133/08G02F1/1303G02F1/1333
Inventor 王佩瑶庄学平陈怡全阳耀
Owner ZHEJIANG KUOSEN FINE CHEM TECH
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