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A process and device for SMD LED injection molding packaging using liquid epoxy resin

A liquid epoxy resin, molding technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as increased reliability and good air tightness, and achieve increased reliability, improved quality, and a wide range of applications. wide effect

Inactive Publication Date: 2016-01-20
HUBEI KUANGTONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to address the above problems and provide a process and device for utilizing liquid epoxy resin to carry out SMD LED injection molding packaging, which can solve the existing problems in the existing SMD LED packaging process, and the products produced have good air tightness and increased reliability. Greatly improved quality and the ability to reduce production costs

Method used

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  • A process and device for SMD LED injection molding packaging using liquid epoxy resin
  • A process and device for SMD LED injection molding packaging using liquid epoxy resin

Examples

Experimental program
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Effect test

Embodiment 1

[0024] A process of utilizing liquid epoxy resin for SMD LED injection molding packaging, the specific steps are:

[0025] 1) Pre-baking glue A of liquid epoxy resin at 60-70°C for 3 hours, then mixing glue A and glue B in a weight ratio of 100:65, and stirring evenly;

[0026] 2) The mixture obtained in step 1) is vacuum degassed, and then injected into the mold of the SMDLED to be packaged under vacuum pressure, and the mold of the SMDLED package is heated while injecting. The heating temperature is 100 ° C ~ 150 ° C, the heating method In order to have a heating rod in the packaging mold, the injection molding material to be injected is solidified, and the SMD LED injection molding packaging process is completed.

Embodiment 2

[0028] A process of utilizing liquid epoxy resin for SMD LED injection molding packaging, the specific steps are:

[0029] 1) Pre-baking glue A of liquid epoxy resin at 70-90°C, then mixing glue A and glue B of liquid epoxy resin in a weight ratio of 100:90, and stirring evenly;

[0030] 2) The mixture obtained in step 1) is subjected to vacuum defoaming, and then injected into the mold of the SMDLED to be packaged under vacuum pressure, the injection molding material to be injected is cured, and the SMDLED injection molding packaging process is completed. The obtained product is as follows: figure 2 shown.

Embodiment 3

[0032] A process of utilizing liquid epoxy resin for SMD LED injection molding packaging, the specific steps are:

[0033] 1) Pre-baking glue A of liquid epoxy resin at 90-110°C, then mixing glue A and glue B of liquid epoxy resin at a weight ratio of 120:65, and stirring evenly;

[0034] 2) The mixture obtained in step 1) is subjected to vacuum defoaming, and then injected into the mold of the SMD LED to be packaged under vacuum pressure, and the injection molding material to be injected is cured, and the SMD LED injection molding packaging process is completed.

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Abstract

The invention discloses a technology and device for carrying out SMD LED mold casting packaging by means of liquid epoxy resin. The technology comprises the steps that liquid epoxy resin glue A and B is used for replacing solid epoxy resin, firstly, the glue A is dried in advance and then mixed with the glue B evenly, vacuum deformation is performed, and the glue is injected into a mold through vacuum pressurization; meanwhile, the mold is heated, and solidification of the liquid epoxy resin is accelerated. The liquid epoxy resin is adopted for SMD LED mold casting packaging, the product air impermeability and reliability are improved, the product quality is greatly improved, the price of the liquid epoxy resin is low, and the product cost is lowered.

Description

technical field [0001] The invention relates to the field of SMD LED production, in particular to a process and a device for performing SMD LED injection mold packaging by using liquid epoxy resin. Background technique [0002] SMD LED adopts injection molding packaging process, which refers to the packaging process of integrated electronic circuits to SMD LED packaging process. In the original packaging process, the main process flow is bracket stamping → solid crystal → short baking → wire bonding → injection →Removal of residues→de-baking→tinning→bending→testing and picking→sorting→inspection→taping and packaging, the molding material inside the pressure injection is solid epoxy resin, put the solid epoxy into The entrance of the glue injection channel is heated with a hydraulic ejector rod to press into the mold glue channel, and the epoxy enters each LED molding groove along the glue channel and is cured. Due to the use of solid epoxy resin, there are disadvantages suc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/56B29C45/14
CPCB29C45/14H01L21/67126H01L33/52H01L33/56H01L2933/0033H01L2933/005
Inventor 彭会银
Owner HUBEI KUANGTONG ELECTRONICS