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A chip radiator based on the principle of thermoelectric refrigeration

A technology of thermoelectric refrigeration and heat sink, which is applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of reduced reliability and achieve a significant effect of heat dissipation

Active Publication Date: 2017-10-03
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Moreover, the famous "10°C rule" also pointed out that for every 10°C increase in the temperature of a semiconductor device, its reliability will decrease by 50%.

Method used

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  • A chip radiator based on the principle of thermoelectric refrigeration
  • A chip radiator based on the principle of thermoelectric refrigeration
  • A chip radiator based on the principle of thermoelectric refrigeration

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Experimental program
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Embodiment Construction

[0011] The present invention is described in more detail below in conjunction with accompanying drawing example:

[0012] to combine Figure 1~3 , the present invention includes: ceramic heat sink 1, positive lead wire 2 of power supply, N-type semiconductor 3, liquid flow channel 4, chip package 5, base 6, P-type semiconductor 7, negative lead wire 8 of power supply, positive metal flow guide bar 9, Negative electrode metal guide bar 10, chip 11; chip 11 and chip package are arranged on the chip base 6, the chip package is provided with a liquid channel 4, and the liquid channel 4 is provided with a P pole semiconductor 7 and an N pole semiconductor 3, The two semiconductors lead into the liquid channel 4 . The N-pole semiconductor 3 and the P-pole semiconductor 7 are provided with metal guide plates 9, 10, respectively connected to the positive pole 2, 8 and the negative pole of the power supply wire. Heat sinks 1 made of ceramic materials are arranged on the metal guide f...

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PUM

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Abstract

The object of the present invention is to provide a chip radiator based on the principle of thermoelectric refrigeration, including a base, a liquid flow channel, a P-pole semiconductor, an N-pole semiconductor, and a ceramic heat sink. The flow channel is set above the base, the P pole semiconductor and the N pole semiconductor are respectively connected to the liquid flow channel, and the negative metal flow guide, the positive metal flow guide, and the negative metal flow guide are respectively set above the P pole semiconductor and the N pole semiconductor. Connect the negative wire of the power supply, the positive metal guide sheet is connected to the positive lead wire of the power supply, and the ceramic heat sink is arranged above the negative metal guide sheet and the positive metal guide sheet. The heat sink designed in the present invention absorbs part of the heat emitted by the chips through the Peltier effect, and the other part of the heat is taken away by the flow of the liquid, so the heat dissipation effect is remarkable.

Description

technical field [0001] The invention relates to a heat sink, specifically a chip heat sink. Background technique [0002] With the advancement of science and technology, the size of electronic devices is getting smaller and smaller, and the degree of integration is getting higher and higher; according to the famous Moore's Law: when the price remains constant, the number of transistors that can be accommodated on an integrated circuit is approximately every 18 Months will double and performance will double. The continuous improvement of chip integration density, packaging density and operating frequency has continuously increased the heat flux density of the chip. Studies have shown that the reliability of electronic equipment is closely related to temperature. Some data show that 55% of the failure of electronic equipment is caused by temperature. Moreover, the famous "10°C rule" also points out that: every time the temperature of a semiconductor device rises by 10°C, it...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/38H01L23/473
Inventor 徐贺王鹏李臻王培元于洪鹏徐燕王文龙孙泽明寇建华
Owner HARBIN ENG UNIV