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Protective film and substrate film for wafer scribing film and manufacturing method of substrate film

A manufacturing method and dicing film technology, which are applied in the field of substrate film and protective film of wafer dicing film, can solve problems such as film rupture and residual glue, and achieve low UV light energy, and it is not easy to rupture film and residual glue. Effect

Active Publication Date: 2015-07-22
WEISHIDA SEMICON TECH ZHANGJIAGANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a protective film, a substrate film for wafer dicing film and its manufacturing method, so as to overcome the technology of film breakage and glue residue in the prior art that tends to occur in the process of wafer dicing question

Method used

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  • Protective film and substrate film for wafer scribing film and manufacturing method of substrate film
  • Protective film and substrate film for wafer scribing film and manufacturing method of substrate film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1: LDPE (Formosa Plastics 9001) 18% content, LLDPE (petrochemical / DFDA-7042) 30% content, MLDPE (ExxonMobil 1018FA) 30% content, EVA (China Taiwan polymerization UE639-04) 20% content , other additives such as opening agent 2%. Blow molding method film (Tailian TL-A90 blown film machine), adopts embossing stick single-sided embossing (1.5kg pressure) with 5um particle size, and substrate film with a thickness of 150um. Appearance inspection, one mirror surface and one side frosted, the texture depth of the frosted surface is 0.6um; the test UV light transmittance is 43%, the tensile strength is 31N, and the elongation is 1060%.

Embodiment 2

[0024] Example 2: 30% content of LDPE (Formosa Plastics 9001), 20% content of LLDPE (petrochemical / DFDA-7042), 40% content of MLDPE (Exxon Mobil 1018FA), 9% content of EVA (Polymerized UE639-04 in Taiwan, China) , other additives such as opening agent 1%. Blow molding method film (Tailian TL-A90 blown film machine), adopts embossing stick with 1um particle size to emboss on one side (0.5kg pressure), and base film with a thickness of 150um. Appearance inspection, one mirror surface and one side frosted, the texture depth of the frosted surface is 0.2um; the test UV light transmittance is 66%, the tensile strength is 47N, and the elongation is 560%.

Embodiment 3

[0025] Example 3: 30% content of LDPE (Formosa Plastics 9001), 26% content of LLDPE (Petrochemical / DFDA-7042), 40% content of MLDPE (ExxonMobil 1018FA), and 4% of other opening aids. Blow molding method film (Tailian TL-A90 blown film machine), using 0.5um particle size embossing stick single-sided embossing (0.2kg pressure), thickness of 150um substrate film. Appearance inspection, one mirror surface and one side frosted, the texture depth of the frosted surface is 0.1um; the test UV light transmittance is 85%, the tensile strength is 50N, and the elongation is 420%.

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Abstract

The invention discloses a protective film and a substrate film for a wafer scribing film and a manufacturing method of the substrate film. The manufacturing method comprises the following steps: (1) mixing materials, wherein in percentage by weight, the materials comprise 5-30 percent of low-density polyethylene (LDPE), 10-45 percent of linear low-density polyethylene (LLDPE), 20-50 percent of metallocene polyolefin (MLDPE), 5-35 percent of an ethylene vinyl-acetate copolymer (EVA) and 0.1-5 percent of an auxiliary; (2) making the materials into a film with a blow moulding method or a flow casting method, and meanwhile, carrying out single-surface embossing by using an embossing roller with the granularity being 0.1-10 [mu]m. Compared with the wafer scribing film product made of a general plastic film, the wafer scribing UV film product made of the obtained substrate film has the advantages that the needed UV light energy is less, and the product cannot stick the roller and has low probability of film breakage and residual gum.

Description

technical field [0001] The application belongs to the technical field of semiconductors, and in particular relates to a protective film, a base film used for wafer dicing film and a manufacturing method thereof. Background technique [0002] The base film of the current wafer cutting and dicing film is generally produced by polymerization of a single type of polyethylene with some additives added. The production process is generally blow molding, casting, and calendering, so that the base film The surface of the substrate is smooth and clean, and the color is transparent, or the surface is treated with a relatively rough textured stick to make the surface granular and white in color, but the wafer dicing film produced by this substrate is generally not high in strength and easy to tear In addition, because the surface is too smooth or too rough, it is very inconvenient for subsequent reuse. [0003] During the use of wafer dicing film, especially for UV type wafer dicing fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08L23/08C08L31/04B29C69/00
CPCB29C69/00C08J5/18C08J2323/06C08J2323/08C08L23/06C08L23/0815C08L2203/16C08L2203/162C08L2205/025C08L2205/03C08L2205/035C08L2207/066C08L31/04
Inventor 陈田安崔庆珑
Owner WEISHIDA SEMICON TECH ZHANGJIAGANG