Paste flux for low-temperature solder paste and preparation method thereof
A technology of solder paste and solder paste, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., to achieve the effect of good application space
Inactive Publication Date: 2015-07-29
SUZHOU HANERXIN ELECTRONICS TECH CO LTD
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- Abstract
- Description
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Problems solved by technology
[0004]Technical problem to be solved: the purpose of this invention is to provide a kind of soldering paste for low-temperature solder paste and its preparation method, aiming at solving the problem that current low-temperature solder paste is prone to black problem
Method used
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Embodiment 1
[0026] Take 50 parts by weight of ethylene glycol, 6 parts of malonic acid, 0.3 parts of ethanolamine, 0.5 parts of dibromoethylbenzene, and 50 parts of rosin, and mix them uniformly to obtain the product.
Embodiment 2
[0028] Take 35 parts of ethylene glycol, 3 parts of malonic acid, 0.6 parts of ethanolamine, 2 parts of dibromoethylbenzene, and 40 parts of rosin by weight, and mix them uniformly to obtain the product.
Embodiment 3
[0030] Take 45 parts by weight of 2-methyl-2,4-pentanediol, 4 parts of malonic acid, 0.45 parts of ethanolamine, 1.5 parts of dibromoethylbenzene, and 45 parts of rosin, and mix them uniformly to obtain the product.
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The invention discloses a paste flux for low-temperature solder paste and a preparation method thereof. The paste flux comprises 35 to 50 parts of a solvent, 3 to 6 parts of malonic acid, 0.3 to 0.6 part of cholamine, 0.5 to 2 parts of dibromoethyl, and 40 to 50 parts of rosin. The preparation method comprises the following steps: weighing 35 to 50 parts of a solvent, 3 to 6 parts of malonic acid, 0.3 to 0.6 part of cholamine, 0.5 to 2 parts of dibromoethyl, and 40 to 50 parts of rosin in parts by weight, uniformly mixing, and then obtaining the paste flux.
Description
【Technical field】 [0001] The invention belongs to the field of soldering technology, and relates to a soldering flux paste for low-temperature solder paste and a preparation method thereof. 【Background technique】 [0002] China will become the main driving force for the development of the global LED market. The government will widely adopt green solutions for LED lighting in the civil and commercial fields, which will revive the LED industry. In the LED industry and some components and PCB boards that cannot withstand high-temperature reflow soldering, the main soldering material used is low-temperature solder paste. Therefore, the market demand for low-temperature solder paste is increasing. [0003] At present, low-temperature solder paste has the advantages of low melting point, excellent printability, good wettability, and no tin beads and solder bridges during reflow; however, the biggest disadvantage of low-temperature solder paste is that it is easy to blacken, bec...
Claims
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IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/362B23K35/3612B23K35/40
Inventor 马鑫
Owner SUZHOU HANERXIN ELECTRONICS TECH CO LTD
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