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Power module package and method of manufacturing the same

一种电源模块、电源装置的技术，应用在半导体/固态器件制造、电路、电气元件等方向，能够解决昂贵等问题

Inactive Publication Date: 2015-07-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, DBC substrates are generally more expensive than thermal substrates, therefore, the price of DBC substrates increases in proportion to the improvement in thermal performance

Method used

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  • Power module package and method of manufacturing the same
  • Power module package and method of manufacturing the same
  • Power module package and method of manufacturing the same

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no. 2 approach

[0054] Such as Figure 6 to Figure 11 As shown, the method for manufacturing a power module package according to a specific embodiment of the present invention mainly includes preparing the heat conduction sheet 120 and manufacturing the power module package 100 using the heat conduction sheet 120 .

[0055] The thermally conductive sheet 120 includes a first resin layer 121 and a second resin layer 122 made of organic materials such as prepreg, epoxy, polyimide, liquid crystal polymer, and the like.

[0056] Here, the first resin layer 121 and the second resin layer 122 include 80% or more of an inorganic filler having thermal conductivity, and the inorganic filler may be selected from the following group of substances, for example, aluminum oxide (Al 2 o 3 ), aluminum nitride (AlN), silicon nitride (SiN), silicon dioxide (SiO 2 ), silicon carbide (SiC), or a combination thereof, and a mixture 120b of phenyl glycidyl ether (PGE) and alkyl glycidyl ether mixed at a mixing ra...

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Abstract

Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority of Korean Patent Application No. 10-2014-0010456 entitled "Power Module Package and Method of Manufacturing the Same" with a filing date of January 28, 2014 , which is hereby incorporated by reference in its entirety into this application. technical field [0003] The invention relates to a power module package and a method for manufacturing the power module package. Background technique [0004] Generally, a power module is an electronic component mounted on a lead frame, which has adopted a structure in which a power device and a control integrated circuit (control IC) are relatively fixed and then molded and packaged. Therefore, since the heat dissipation of the power supply device is mainly realized through the lead frame, and the thermal conductivity of the epoxy mold packaging material (EMC) is low, the required thermal performance of the power module may not be satisfied. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/495H01L23/433H01L23/31H01L23/373
CPCH01L24/85H01L2924/14H01L25/50H01L23/49575H01L25/165H01L2924/1203H01L23/3107H01L21/565H01L23/49568H01L2924/13091H01L23/3735H01L2924/13055H01L23/3737H01L23/4334H01L23/49551H01L24/48H01L2224/48091H01L2224/48137H01L2224/48247H01L2924/181H01L2224/85H01L2224/45139H01L2224/45144H01L2224/45124H01L2224/45147H01L2224/4516H01L2224/45166H01L24/45H01L2924/00014H01L2924/00012
Inventor 金洸洙蔡埈锡郭煐熏
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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