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A Method of Improving the Resolution of Digital Lithography Based on Subpixel Modulation

A sub-pixel and resolution technology, applied in the direction of microlithography exposure equipment, photolithography exposure device, etc., can solve the problems of limited resolution of digital lithography technology, achieve the effect of reducing production cost and solving low resolution

Active Publication Date: 2017-03-22
NANCHANG HANGKONG UNIVERSITY
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Problems solved by technology

[0003] The purpose of the present invention is to provide a digital lithography method based on sub-pixel modulation to solve the problem of limited resolution of SLM-based digital lithography technology

Method used

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  • A Method of Improving the Resolution of Digital Lithography Based on Subpixel Modulation

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[0016] Such as figure 1 As shown, taking the reflective SLM as an example (such as DMD), the present invention is realized in this way: firstly adjust the focus of the system, close the 2# shutter 3, open the 1# shutter 2, and the light emitted by the visible light LED focusing light source 1 passes through The 1# beam splitter 5 is divided into two, and the split light reaches 1#SLM 13 and 2#SLM 6 respectively through the total reflection mirror. 1#SLM 13 and 2#SLM 6 are respectively transmitted by the computer at the same time to display different numbers mask. The light modulated and reflected by the two SLMs passes through the 2# beam splitter 8 and the 3# beam splitter 9 to reach the compacting lens 10 at the same time, and the light modulated by the 1# and 2# SLMs is compacted and imaged on the substrate 11 at the same time. The image formed on the substrate 11 is reflected by the substrate and enters the compacting lens, then enters the 3# beam splitter 9, and then is ...

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Abstract

A method for improving the resolution of digital lithography based on sub-pixel modulation, which is characterized in that in a multi-SLM digital lithography system, the relative position of the corresponding SLM projection is adjusted through a five-degree-of-freedom precision adjustment system, and any two SLMs are controlled , so that the two patterns projected onto the substrate are misaligned in two directions parallel to the substrate plane, and the misalignment distance is not greater than the size corresponding to one pixel of the SLM, so that the SLM-based digital lithography system can produce images smaller than the size of a single pixel. Lines, so as to improve the horizontal production resolution of SLM digital lithography based on sub-pixel modulation. The method of the present invention adopts the method of dislocation and overlapping exposure of multiple SLM projections at the same time, breaks through the minimum exposure resolution limited by the pixel size of a single SLM, can effectively solve the problem of low resolution of the digital lithography system, and realize high-precision digital photolithography. Engraving production, greatly reducing the cost of high-precision lithography production.

Description

technical field [0001] The invention relates to a method for improving the resolution of digital lithography, in particular to a method for improving the resolution of digital lithography based on sub-pixel modulation. Background technique [0002] The digital lithography method based on the spatial light modulator (SLM) has attracted extensive attention at home and abroad due to its advantages of simple mask design, low production cost, and short production cycle. Due to the influence of the minimum imaging resolution, the current SLM-based digital lithography technology is only suitable for making microstructures above the micron level. In order to break through this manufacturing limitation, there are two main solutions: one is to reduce the pixel size of the SLM, and the other is to improve the imaging resolution of the compact lens. Since the reduction of SLM pixel size must rely on the mature development of micro-electromechanical system (MEMS) technology, it is extre...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 张志敏罗宁宁李淑静
Owner NANCHANG HANGKONG UNIVERSITY
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