Unlock instant, AI-driven research and patent intelligence for your innovation.

Multimodule

A multi-module, packaging substrate technology, applied in the multi-module field, can solve the problems of increased power consumption and large circuit power consumption, and achieve the effect of suppressing deterioration

Inactive Publication Date: 2015-08-12
HITACHI METALS LTD
View PDF1 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the circuit for compensating for signal degradation consumes a lot of power, which is a major factor in the increase in power consumption of computers, servers, and network equipment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multimodule
  • Multimodule
  • Multimodule

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0032] Hereinafter, an example of embodiment of the present invention will be described in detail with reference to the drawings. figure 1 The shown multi-module 1A has a base 10 as a supporting member, and a plurality of first modules 11 mounted on the base 10 .

[0033] The base 10 is formed of a bent metal plate (for example, 2 mm in thickness) and has an octagonal cross-sectional shape. That is, the base 10 has eight side walls 10a, and the first modules 11 are respectively mounted on these side walls 10a. That is, in the present embodiment, each side wall 10 a of the chassis 10 is a mounting portion on which the first module 11 is mounted.

[0034] In the present embodiment, one first module is mounted on the outer surface of each of the eight side walls 10 a of the chassis 10 . That is, the multi-module 1A includes eight first modules 11 . These first modules 11 are appropriately connected via cables inside the base 10 . In the following description, the outer surfac...

no. 2 Embodiment approach

[0056] Below, refer to Figure 5 ~ Figure 7 Another example of the embodiment of the present invention will be described in detail. However, the multi-module of the present embodiment has the same basic structure as the multi-module of the first embodiment. Therefore, points different from the multi-module of the first embodiment will be mainly described. In addition, about the same structure as the multi-module of 1st Embodiment, the same code|symbol is attached|subjected in a figure, and description is abbreviate|omitted suitably.

[0057] Figure 5 In the shown multi-module 1B, five first modules (processor modules) 11 are mounted on each mounting surface 10b of the chassis 10 along its longitudinal direction (height direction), and each processor module 11 is stacked and mounted 2nd module 12.

[0058] Such as Figure 6 As shown, the second module 12 includes a second package 61 having substantially the same external shape as that of the first metal package 41 . The se...

no. 3 Embodiment approach

[0073] Below, refer to Figure 8 Another example of the embodiment of the present invention will be described in detail. However, the multi-module of the present embodiment has the same basic structure as the multi-module of the first and second embodiments. Therefore, points different from the multi-modules of the first and second embodiments will be mainly described. In addition, regarding the same configuration as the multi-modules of the first and second embodiments, in Figure 8 The same symbols are attached in , and explanations are omitted appropriately.

[0074] Figure 8 The illustrated multi-module 1C has a first module (processor module) 11 and a second module (memory module) 12 . The processor module 11 is mounted on the base 10 , and the memory module 12 is stacked on the processor module 11 . These chassis 10, processor module 11, and memory module 12 have the same configuration as those of the chassis 10, processor module 11, and memory module 12 in the fir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A plurality of modules is densely arranged in a small space, and degradation of high-speed digital signals transmitted between these modules is suppressed. A chassis to which a power cable and an optical signal cable are drawn is provided, and a plurality of first modules which are mounted on the chassis and which are connected to the power cable and the optical signal cable are provided. Each first module includes: a first metal package; a first package substrate accommodated in the first metal package and thermally connected to the first metal package; and a first semiconductor chip equipped on the first package substrate, and the chassis and the first metal package included in each first module are thermally connected to each other.

Description

technical field [0001] The present invention relates to a multi-module in which a plurality of modules are mounted on a common support member. Background technique [0002] Computers, servers, network equipment, and the like generally have a printed circuit board called a "main board" on which a plurality of modules (communication module, memory module, storage module, etc.) are mounted. Each module has a substrate called a "module substrate" or a "package substrate", on which a semiconductor chip (memory chip, control device for controlling a memory chip) corresponding to the application is mounted directly or via an interposer. chip, etc.). That is, the semiconductor chip included in each module is connected to the main board via the package substrate, and is connected to other modules on the main board or modules included in other devices via the main board. In the following description, a substrate on which a semiconductor chip is mounted directly or via an interposer ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/00H05K7/02
CPCH05K7/20709H05K7/1487H05K7/20409H01L25/10H01L2225/1023H01L2924/0002H01L2924/00
Inventor 须永义则
Owner HITACHI METALS LTD