A copper electroplating device
A technology of electroplating copper and dissolving copper, applied in the direction of electrolytic coating, etc., can solve the problems of high unit price of copper oxide, poor uniformity of electroplated copper layer, uneven distribution of anodes, etc.
Inactive Publication Date: 2017-04-26
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
In the prior art, soluble anodes have uneven distribution of anodes, which leads to poor uniformity of the electroplated copper layer; insoluble anodes have good uniformity of electroplated copper layers, but copper oxide needs to be added to supplement the consumed copper ions, and copper oxide is relatively high in unit price, resulting in The problem of high cost of electroplating
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[0026] Such as figure 1 As shown, the copper electroplating device includes a copper electroplating cylinder 1 , a copper melting bucket 2 , a liquid mixing bucket 3 , a return pipe 4 , a liquid outlet pipe 5 , a filter pump 6 , and a connecting pipe 7 .
[0027] The electroplating copper cylinder 1 is provided with a mesh-shaped anode electrode 11, and the anode electrode 11 is a stainless steel mesh or a titanium mesh.
[0028] The outlet pipe 5 communicates with the bottom of the electroplating copper cylinder 1 and the top of the copper-dissolving barrel 2 . The return pipe 4 communicates with the bottom of the copper-dissolving bucket 2 and the top of the electroplating copper cylinder 1 . The filter pump 6 is located on the return pipe 4 between the electroplating copper cylinder 1 and the copper-dissolving barrel 2, and the filter pump 6 is used for filtering the electroplating solution and providing circulation power. The mixing tank 3 is located on the return pipe 4...
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Abstract
The invention discloses a circuit board electro-coppering device and belongs to the field of circuit board manufacturing. The electro-coppering device comprises an electro-coppering vat, a copper dissolving bucket, a liquid outlet pipe and a backflow pipe, wherein a copper block is arranged in the copper dissolving bucket; the liquid outlet pipe is communicated with the electro-coppering vat and the copper dissolving bucket, the backflow pipe is communicated with the electro-coppering vat and the copper dissolving bucket, and electroplating liquid in the electro-coppering vat enters the copper dissolving bucket through the liquid outlet pipe and then enters the electro-coppering vat through the backflow pipe. The electro-coppering device is applicable to insoluble anode electroplating, relatively cheap pure copper balls can be used to replace existing coppering liquid for copper oxide process and the manufacturing cost is reduced; the electro-coppering device is simple to operate and the operating intensity of workers is reduced; in addition, the content of copper ions in the coppering liquid is more stable and the quality of electro-coppered layers is higher.
Description
technical field [0001] The invention belongs to the field of circuit board production and manufacturing, in particular to a circuit board copper electroplating device. Background technique [0002] There are two types of copper electroplating technology for circuit boards: soluble anode and insoluble anode. The soluble anode directly uses copper balls in a titanium basket as the anode. Because the electrolytic voltage of titanium is high and the electrolytic voltage of copper is low, in an electroplating device with an appropriate voltage, The anode copper ball electrolyzes copper ions in the same proportion according to the size of the current to maintain the copper ion content in the copper plating solution; the insoluble anode uses stainless steel or titanium mesh as the anode, and copper oxide is added during the electroplating process to maintain the copper content in the copper plating solution. ion content. In the prior art, soluble anodes have uneven distribution of...
Claims
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IPC IPC(8): C25D19/00
Inventor 常文智姜雪飞彭卫红刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB