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Micro vibration reducing platform based on MEMS spring

A vibration isolation platform and platform technology, applied in the direction of high internal friction springs, non-rotational vibration suppression, etc., can solve the problems of small damping, damage to the vibration damping structure, and unsatisfactory effects, so as to prolong the impact time and improve the effect of small damping

Inactive Publication Date: 2015-08-26
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to its small damping, a large amplitude is required to achieve the desired effect when subjected to high-frequency impact, but excessive amplitude may cause damage to the damping structure
Some improvements have been made to it in recent years, but the effect is not ideal

Method used

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  • Micro vibration reducing platform based on MEMS spring
  • Micro vibration reducing platform based on MEMS spring
  • Micro vibration reducing platform based on MEMS spring

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Experimental program
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Effect test

Embodiment Construction

[0020] The present invention will be described in detail below through embodiments in conjunction with the accompanying drawings.

[0021] Such as figure 1 As shown, the MEMS spring-based micro-vibration damping platform of the present invention includes: an upper unit vibration isolation platform 1, an upper plane spring 2, an upper damping glue 3, a middle unit vibration isolation platform 4, a middle plane spring 5, and a middle damping glue 6. The lower unit vibration isolation platform 7, the lower plane spring 8 and the frame 9. Among them, the corresponding planar springs are arranged around the vibration isolation platform of each unit, the lower surfaces of the upper and middle unit vibration isolation platforms are evenly coated with vibration damping glue, and the frame 9 is set around the three layers of planar springs.

[0022] figure 2 It is a top view of the MEMS spring-based miniature vibration damping platform of the present invention. It can be seen that t...

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Abstract

The invention discloses a micro vibration reducing platform based on a MEMS spring. The micro vibration reducing platform mainly consists of three layers of unit vibration reducing platforms, wherein vibration reducing glue is uniformly coated on the lower surfaces of the upper and middle layers of unit vibration reducing platforms; boss arrays are arranged on the upper surfaces of the middle and lower layers of unit vibration reducing platforms; plane springs are arranged around each layer of unit vibration reducing platforms; and edge frames are arranged around the plane springs. The micro vibration reducing platform can effectively prolong the collision time and absorb the impact energy through the deformation of the plane springs and the completely inelastic collision of the boss arrays and the vibration reducing glue. After the boss arrays and the vibration reducing glue are collided, the three layers of platforms are formed to a whole, so that the spring rigidity is multiplied, and the large-damping vibration reduction is realized. If the micro vibration reducing platform is used in a liquid environment, intervals between the plane springs and the vibration reducing platforms and intervals among all layers of vibration reducing platforms can generate higher slide film damping and pressed film damping under high-frequency impact. The main structure of the micro vibration reducing platform adopts a silicon-based material; and the micro vibration reducing platform is suitable for large-scale preparation by a MEMS process.

Description

technical field [0001] The invention belongs to the technical field of MEMS, and in particular relates to a micro-vibration damping platform based on MEMS springs. Background technique [0002] Micro-electromechanical system MEMS integrates micro-circuit and micro-mechanical functions. It is widely used because of its small size, light weight, low power consumption, good durability, low price, and stable performance. It is the future of national economy and military scientific research. new growth point. Many MEMS devices often need to work in harsh vibration environments. For example, MEMS devices used on spacecraft will withstand random vibration loads of 20-2000 Hz during launch, and the overload of the device can reach more than 10,000g during shooting. A slight vibration environment will affect the performance of the device, and a harsh vibration environment may even cause permanent structural damage to the device. Therefore, a vibration damping platform is needed to i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16F3/10F16F15/08
CPCF16F3/10F16F15/08
Inventor 徐楷斯张威苏卫国朱宁莉万松
Owner PEKING UNIV
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