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Substrate for power module and manufacturing method

A technology for power modules and substrates, which is applied in the manufacture of printed circuits, assembling printed circuits with electrical components, and reducing the stress/deformation of printed circuits. Achieve the effect of reducing thermal load, improving reliability, and reducing thermal degradation

Active Publication Date: 2018-07-13
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Brazing Since the joining temperature during brazing is high (for example, about 650°C), the heat load applied to the power module substrate is large, and the power module substrate (especially the insulating layer) may deteriorate
[0015] In addition, due to the high joining temperature of brazing, the thermal stress generated on the power module substrate or metal parts increases, and the warpage of the power module substrate or metal parts may increase.

Method used

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  • Substrate for power module and manufacturing method
  • Substrate for power module and manufacturing method
  • Substrate for power module and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0196] Hereinafter, the results of confirmation experiments conducted to confirm the effects of the present invention will be described.

[0197] (example of the present invention)

[0198] As Example 1 of the present invention, the power module with a heat sink described in the aforementioned embodiments was prepared. That is, on the surface of the metal layer and the circuit layer of the substrate for a power module, a first underlayer and a second underlayer composed of a fired body of glass-containing Ag paste are formed, and after the third underlayer is formed on the heat sink, The substrate for the power module and the heat sink were bonded through a bonding layer made of a fired body of silver oxide paste.

[0199] Furthermore, a rectangular plate made of AlN, 30 mm×30 mm, and 0.635 mm thick was used as the ceramic substrate.

[0200] Moreover, the circuit layer and metal layer used the rectangular board which consists of 4N aluminum, 29 mm x 29 mm, and thickness 0.6...

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Abstract

A substrate for a power module according to the present invention includes an insulating layer (11), a circuit layer (12) formed on a first surface of the insulating layer, and a metal layer (13) formed on a second surface of the insulating layer, On the surface of the metal layer opposite to the surface on which the insulating layer is provided, a first base layer (20) is stacked, and the first base layer has a layer formed at the interface with the metal layer. The first glass layer, and the first Ag layer laminated on the first glass layer.

Description

technical field [0001] The present invention relates to a substrate for a power module having a circuit layer formed on one surface (first surface) of an insulating layer and a metal layer formed on the other surface (second surface) of the insulating layer, and a substrate for bonding to a power module. Power module substrates with metal components for metal components on the metal layer side of the substrate, power modules with metal components including semiconductor elements mounted on the circuit layer of the power module substrate with metal components, power modules A method of manufacturing a substrate, and a method of manufacturing a substrate for a power module with its own metal parts. [0002] This application claims priority based on Patent Application No. 2012-284641 for which it applied in Japan on December 27, 2012, and uses the content here. Background technique [0003] Among various semiconductor elements, power elements for high-power control used to con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H01L23/40H05K1/02
CPCH01L23/3735H01L23/42H01L2224/32225C04B37/021C04B2237/343C04B2237/366C04B2237/368C04B2237/402C04B2237/407C04B2237/86H05K3/0061H01L23/473H05K3/248H05K3/32H05K2201/066H05K2201/09136H05K1/0203H05K1/0271H05K1/0298H05K1/0306H05K1/09H05K3/465H05K7/14
Inventor 西元修司长友义幸
Owner MITSUBISHI MATERIALS CORP