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Semiconductor device and method for detecting damage to semiconductor device

A technology for detecting electrical devices and defects, which is applied in semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, optical waveguide coupling, etc., and can solve problems such as film structure cracks

Active Publication Date: 2020-02-07
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For semiconductor devices that include membrane structures, such as e.g. for integrated pressure sensors, a major yield and reliability risk is cracks in the membrane structure

Method used

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  • Semiconductor device and method for detecting damage to semiconductor device
  • Semiconductor device and method for detecting damage to semiconductor device
  • Semiconductor device and method for detecting damage to semiconductor device

Examples

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Embodiment Construction

[0014] Various example embodiments will now be described more fully with reference to the accompanying drawings, in which some example embodiments are illustrated. In the drawings, the thickness of lines, layers and / or regions may be exaggerated for clarity.

[0015] Accordingly, while the example embodiments are capable of various modifications and alternative forms, embodiments thereof are shown by way of example in the drawings and will be described in detail herein. It should be understood that there is no intention to limit example embodiments to the particular forms disclosed, but on the contrary example embodiments are to cover all modifications, equivalents, and alternatives falling within the scope of the disclosure. Like numbers refer to like or similar elements throughout the description of the figures.

[0016] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to ...

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Abstract

The present invention involves semiconductor devices and methods of detecting semiconductor devices.A microcomputer electrical component that includes a mobile structure, where the mobile structure includes the test structure. If the mobile structure is damaged, the test structure changes the electrical characteristics.

Description

technical field [0001] Embodiments relate to semiconductor devices and in particular to semiconductor devices including film structures and methods of detecting damage to film structures of semiconductor devices. Background technique [0002] For semiconductor devices comprising membrane structures, such as eg for integrated pressure sensors, a major yield and reliability risk is cracking of the membrane structure. Certain efforts have been made to detect these cracks. For example, these cracks can be detected in-line by optical inspection. It may be desirable to provide semiconductor devices with more comfortable crack detection. Contents of the invention [0003] Some embodiments relate to microelectromechanical devices including movable structures. The movable structure includes a test structure that changes electrical characteristics if the movable structure is damaged. [0004] Some embodiments relate to semiconductor devices. The semiconductor device includes a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B5/00B81B7/02
CPCH01L22/34B81B2201/0264G01L27/007B81B7/02B81C99/0035G01R31/2644H01L22/30
Inventor D·梅因霍尔德
Owner INFINEON TECH AG