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Electronic devide

A technology of electronic equipment and components, which is applied in the field of electronic equipment and can solve problems such as substrate bending

Inactive Publication Date: 2015-09-09
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, even when the above-mentioned conventional circuit board is used in an electronic device, the board may be bent when the connector is attached or detached during assembly or maintenance of the electronic device.

Method used

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  • Electronic devide
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Experimental program
Comparison scheme
Effect test

no. 1 approach ＞

[0018] Such as figure 1 As shown, the electronic device 1 includes a housing 2, a display device (not shown), and the like. In this embodiment, for example, a substrate 3 (circuit substrate, control substrate, main substrate) is accommodated in a casing 2 , and a display device (not shown) is provided in a casing different from the casing 2 . The housing 2 (substrate 3 ) and another housing (display device) can be electrically connected via cables (wires, cables, not shown).

[0019] The housing 2 is configured in a rectangular shape (for example, a rectangle) when viewed from the front. Such as figure 1 As shown, the frame body 2 has a plurality of wall portions 2a to 2c. In the present embodiment, any one of the plurality of wall parts 2a to 2c (for example, the wall part 2c) can be used in a posture along a plane. In addition, in the following detailed description, for convenience, the direction is prescribed|regulated based on the attitude|position of the wall part 2c ...

no. 2 approach ＞

[0034] Figure 4 The electronic device 1A of the illustrated embodiment has the same configuration as the electronic device 1 of the first embodiment described above. Therefore, according to this embodiment as well, the same result (effect) based on the same configuration as that of the above-mentioned first embodiment can be obtained.

[0035] However, in this embodiment, for example, as Figure 4 As shown, the suppressing member 6A has a hook portion 11 . The hook portion 11 has a protruding portion 11a protruding from the second surface 6b toward the substrate 3 side, and a direction intersecting the protruding portion 11a at the end (tip portion) of the protruding portion 11a (in this embodiment, as an example, It is the claw part 11b which protrudes (protrudes) in the orthogonal direction, along the direction of the board|substrate 3 (2nd surface 3b). The hook portion 11 can be constituted by, for example, a plurality of (two) divided members, an elastic member interpo...

no. 3 approach ＞

[0037] Figure 5 The electronic device 1B of the illustrated embodiment has the same configuration as the electronic device 1 of the first embodiment described above. Therefore, also in this embodiment, it is possible to obtain the same result (effect) based on the configuration similar to that of the above-mentioned first embodiment.

[0038] However, in this embodiment, for example, as Figure 5 As shown, the suppressing member 6B includes a plurality of (for example, three) members 61 to 63 . The member 61 (first member, base) is located on the side opposite to the member 63 (the substrate 3 side) of the member 62 . Part 62 (second part, first connection part, first regulator, first spacer) is located between part 61 and part 63 . The member 63 (third member, second connection member, second adjuster, and second spacer) is located on the opposite side of the member 62 to the member 61 (the wall portion 2b1 side). The plurality of members 61 to 63 are joined (integrated)...

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PUM

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Abstract

The invention discloses an electronic device which is capable of inhibiting the curling of the substrate in the process of disassembling and assembling the connector when the electronic is being assembled and maintained. The electronic device comprises a framework, the substrate, the connector and the inhibition member. The framework body has the first wall body. The substrate is contained in the framework, and ha the first face of the first wall and the second face on the opposite side of the first wall; the substrate is detached from the first wall portion. The connector is positioned on the second face. The inhibition member is arranged between the first face and the first wall, and at least part of the inhibition device is superposed with the connector along the thickness direction.

Description

[0001] This application is based on Japanese patent application 2014-0042069 (filing date: 03 / 04 / 2014), and enjoys the priority benefit of this application. This application incorporates the entire content of this application by reference. technical field [0002] Embodiments of the present invention relate to an electronic device. Background technique [0003] Conventionally, there is known a circuit board in which reinforcing plates are provided on both upper and lower surfaces to make the board difficult to bend. [0004] Patent Document 1: Japanese Patent Application Laid-Open No. 8-274423 [0005] However, even when the above-mentioned conventional circuit board is used in an electronic device, the board may warp when the connector is attached or detached during assembly or maintenance of the electronic device. That is, it is more preferable if a configuration capable of suppressing warping of the substrate more effectively can be obtained. Contents of the invention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0271H05K5/0052H05K5/0069
Inventor 中村匡亨
Owner KK TOSHIBA