Sputtering targets containing co or fe

A sputtering target and particle technology, applied in sputtering plating, ion implantation plating, coating, etc., can solve problems such as insufficient conditions, and achieve the effect of cost improvement and yield increase
CN104903488BActive Publication Date: 2018-02-16JX NIPPON MINING & METALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JX NIPPON MINING & METALS CORP
Publication Date
2018-02-16

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Abstract

The present invention relates to a sintered body sputtering target. The structure observed on the polished surface of the target is composed of a metal phase containing Co or Fe and metal particles dispersed with non-magnetic material particles with an average particle diameter of 1.8 μm or less. When the maximum value of the distance between any two points located on the outer circumference of the non-magnetic material particle is set as the maximum diameter, and the minimum value of the distance between the two straight lines when the particle is clamped by two parallel straight lines is set as the minimum diameter, the The difference between the maximum diameter and the minimum diameter is 0.7 μm or less of the non-magnetic material particles relative to the non-magnetic material particles in the structure observed on the polished surface of the target is 60% or more, and, in the When the maximum value of the distance between two arbitrary points is defined as the maximum diameter, and the minimum value of the distance between the two straight lines when metal particles are sandwiched between two parallel lines is defined as the minimum diameter, the sum of the maximum diameter and the minimum diameter is 30 μm or more There is an average of one or more metal particles within a field of view of 1 mm2, and this sintered sputtering target can suppress abnormal discharge caused by a non-magnetic material that causes particle generation during sputtering.
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Description

technical field

[0001] The present invention relates to a magnetic material sputtering target used for forming a magnetic thin film of a magnetic recording medium, especially a particle film in a magnetic recording medium of a hard disk using a perpendicular magnetic recording method, and relates to a magnetic material sputtering target capable of suppressing the generation of particles during sputtering The reason is the abnormal discharge of non-magnetic materials and the non-magnetic material particle dispersion type magnetic material sputtering target with Co or Fe as the main component. Background technique

[0002] Materials based on Co, Fe, and Ni, which are ferromagnetic metals, are used for the recording layer of a hard disk employing a perpendicular magnetic recording method. Among them, composite materials containing ferromagnetic alloys such as Co-Cr bases, Co-Pt bases, Co-Cr-Pt bases, Fe-Pt bases and non-magnetic inorganic materials mainly composed of Co and Fe ...

Claims

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