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Acoustic ray bending demonstration experimental device in gradient temperature field

A technology of gradient temperature and experimental device, applied in educational appliances, instruments, teaching models, etc., can solve the problems of invisibility, difficulty in understanding the mechanism of natural phenomena for students, etc., and achieve low product cost, simple demonstration method, and good intuition. Effect

Inactive Publication Date: 2017-05-17
SHAANXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As a mechanical wave, the transmission of sound in the air is invisible, that is, the bending phenomenon of sound rays, which cannot be directly perceived through visual inspection, which makes it difficult for students to understand the mechanism of this natural phenomenon

Method used

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  • Acoustic ray bending demonstration experimental device in gradient temperature field
  • Acoustic ray bending demonstration experimental device in gradient temperature field

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] exist figure 1 , 2 Among them, the sound ray bending demonstration experiment device in the gradient temperature field of this embodiment consists of a transparent water tank 1, an ultrasonic transducer 2, a semiconductor cooling chip 3, a light emitting diode 4, a piezoelectric chip 5, a semiconductor cooling chip bracket 6, and a temperature sensor 7 , display 8 connections form.

[0016] The transparent water tank 1 of the present embodiment is made of plexiglass, and can also be made of quartz glass. The geometric shape of the transparent water tank 1 is a cuboid. The transparent water tank 1 is filled with water, and the left side wall of the transparent water tank 1 is fastened with threads. The connecting piece is fixedly connected with an ultrasonic transducer 2, the radiating end surface of the ultrasonic transducer 2 passes through the left side wall of the transparent water tank 1 and is immersed in water, the centerline of the radiating end surface of the u...

Embodiment 2

[0019] A semiconductor cooling chip support 6 is fixedly installed on the front side wall in the transparent water tank 1, and a semiconductor cooling chip bracket 6 is fixedly installed on the rear side wall in the transparent water tank 1, and each semiconductor cooling chip bracket 6 is fixed. A semiconductor cooling chip 3 is connected, and the semiconductor cooling chip bracket 6 and the semiconductor cooling chip 3 are immersed in water. The position is the same as that of Embodiment 1, the front sides of the two semiconductor refrigerating sheets 3 are hot surfaces, the front sides are perpendicular to the horizontal plane, and parallel to the front side wall of the transparent water tank 1, and the horizontal center planes of the two semiconductor refrigerating sheets 3 are on the same plane. in the horizontal plane and in the same plane as the transverse centerline of the tank.

[0020] Other components and the coupling relationship of the components are the same as i...

Embodiment 3

[0022] In the above embodiments 1 and 2, two semiconductor cooling chip supports 6 are fixedly installed on the front side wall in the transparent water tank 1, and two semiconductor cooling chip brackets 6 are fixedly installed on the rear side wall in the transparent water tank 1. 1 semiconductor cooling chip support 6 is fixedly connected with a semiconductor cooling chip 3, the semiconductor cooling chip support 6 and the semiconductor cooling chip 3 are immersed in water, and the distance from the upper surface of the semiconductor cooling chip 3 to the water surface is the same as that of the corresponding embodiment, 4 The geometrical shape of each semiconducting refrigerating sheet 3 and the position in transparent water tank 1 are identical with embodiment 1, and the front side of 4 semiconducting cooling sheets 3 is a thermal surface, and the front side is perpendicular to the horizontal plane, parallel to the front side wall of transparent water tank 1 , the horizont...

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Abstract

The invention relates to a demonstration experiment device for a sound ray curve in a gradient temperature field, which is characterized in that a front side wall and a rear side wall inside a transparent water tank are provided with at least one semiconductor refrigeration sheet bracket, each semiconductor refrigeration sheet bracket is provided with a semiconductor refrigeration sheet, the semiconductor refrigeration sheet bracket and the semiconductor refrigeration sheet are immersed into water, the distance between the upper surface of the semiconductor refrigeration sheet and the water surface is at least 100mm, the front side surface of the semiconductor refrigeration sheet is a hot surface or a cold surface, the hot surface is vertical with the horizontal plane and parallel to the front side wall of the transparent water tank, horizontal central planes of the front and back semiconductor refrigeration sheets are located in the same horizontal plane and are located in the same plane with a transverse center line of the water tank, a left side wall of the transparent water tank is provided with an ultrasonic transducer, an inner wall at the right side is provided with a column of piezoelectric patches and a column of temperature sensors, and an outer wall at the right side is provided with a temperature display connected with each temperature sensor through a wire and a column of light-emitting diodes connected with each piezoelectric patch through a wire.

Description

technical field [0001] The invention belongs to the technical field of experimental teaching instruments, and in particular relates to a visual demonstration experimental device for sound ray bending in a gradient temperature field. Background technique [0002] People have done a lot of research on the propagation of sound rays in inhomogeneous media, especially the phenomenon of bending transmission of sound rays to lower temperature regions in the temperature gradient field, which widely exists in nature. For example, the patent number is ZL201010119797.9, and the invention name is "Pipeline Noise Reduction Based on Sound Ray Bending Transmission Principle" Chinese invention patent. [0003] As a mechanical wave, the transmission of sound in the air is invisible, that is, the bending phenomenon of sound rays, which cannot be directly perceived through visual inspection, which makes it difficult for students to understand the mechanism of this natural phenomenon. How to r...

Claims

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Application Information

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IPC IPC(8): G09B23/14
CPCG09B23/14
Inventor 张宗权黄育红任俊鹏刘志存杨宗立鲁佰佐
Owner SHAANXI NORMAL UNIV