Acoustic ray bending demonstration experimental device in gradient temperature field
A technology of gradient temperature and experimental device, applied in educational appliances, instruments, teaching models, etc., can solve the problems of invisibility, difficulty in understanding the mechanism of natural phenomena for students, etc., and achieve low product cost, simple demonstration method, and good intuition. Effect
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Embodiment 1
[0015] exist figure 1 , 2 Among them, the sound ray bending demonstration experiment device in the gradient temperature field of this embodiment consists of a transparent water tank 1, an ultrasonic transducer 2, a semiconductor cooling chip 3, a light emitting diode 4, a piezoelectric chip 5, a semiconductor cooling chip bracket 6, and a temperature sensor 7 , display 8 connections form.
[0016] The transparent water tank 1 of the present embodiment is made of plexiglass, and can also be made of quartz glass. The geometric shape of the transparent water tank 1 is a cuboid. The transparent water tank 1 is filled with water, and the left side wall of the transparent water tank 1 is fastened with threads. The connecting piece is fixedly connected with an ultrasonic transducer 2, the radiating end surface of the ultrasonic transducer 2 passes through the left side wall of the transparent water tank 1 and is immersed in water, the centerline of the radiating end surface of the u...
Embodiment 2
[0019] A semiconductor cooling chip support 6 is fixedly installed on the front side wall in the transparent water tank 1, and a semiconductor cooling chip bracket 6 is fixedly installed on the rear side wall in the transparent water tank 1, and each semiconductor cooling chip bracket 6 is fixed. A semiconductor cooling chip 3 is connected, and the semiconductor cooling chip bracket 6 and the semiconductor cooling chip 3 are immersed in water. The position is the same as that of Embodiment 1, the front sides of the two semiconductor refrigerating sheets 3 are hot surfaces, the front sides are perpendicular to the horizontal plane, and parallel to the front side wall of the transparent water tank 1, and the horizontal center planes of the two semiconductor refrigerating sheets 3 are on the same plane. in the horizontal plane and in the same plane as the transverse centerline of the tank.
[0020] Other components and the coupling relationship of the components are the same as i...
Embodiment 3
[0022] In the above embodiments 1 and 2, two semiconductor cooling chip supports 6 are fixedly installed on the front side wall in the transparent water tank 1, and two semiconductor cooling chip brackets 6 are fixedly installed on the rear side wall in the transparent water tank 1. 1 semiconductor cooling chip support 6 is fixedly connected with a semiconductor cooling chip 3, the semiconductor cooling chip support 6 and the semiconductor cooling chip 3 are immersed in water, and the distance from the upper surface of the semiconductor cooling chip 3 to the water surface is the same as that of the corresponding embodiment, 4 The geometrical shape of each semiconducting refrigerating sheet 3 and the position in transparent water tank 1 are identical with embodiment 1, and the front side of 4 semiconducting cooling sheets 3 is a thermal surface, and the front side is perpendicular to the horizontal plane, parallel to the front side wall of transparent water tank 1 , the horizont...
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