Organic light emitting diode display panel, manufacturing method thereof and display

Abstract

The invention provides an organic light emitting diode OLED display panel, a manufacturing method thereof and a display. The temperature difference between heated glass cement of a dug area and heated glass cement of another area is reduced, so that uniform laser sintering state is realized in the OLED display panel. The overall package performance of the glass cement is improved. The OLED display panel comprises back plate glass, cover plate glass, and glass cement located between the back plate glass and the cover plate glass and a number of metal blocks. Each metal block is covered by an inorganic protective layer. A dug area is arranged between two adjacent metal blocks. The glass cement contacts the back plate glass through the dug area. The OLED display panel is characterized in that at least one metal block and the inorganic protective layer which covers the metal block have a surface which reflects incident laser into a dug area.

Description

technical field [0001] The invention relates to the technical field of displays, in particular to an organic light emitting diode display panel, a manufacturing method thereof, and a display. Background technique [0002] An organic light-emitting diode (Organic Light-Emitting Diode, OLED for short) display is also called an organic electro-laser display. An OLED device is a display device that drives a luminescent material to emit light autonomously by an electric current. OLED needs to ensure the long-term normal operation of the internal device structure through good sealing. The prior art usually adopts glass glue (Frit) packaging technology, wherein the laser sintering process plays a key role in the sealing performance of the glass glue. [0003] In the prior art, a large piece of metal is designed under the glass glue coating area and a hole is designed on the big piece of metal to ensure that the glass glue can be in direct contact with the backplane glass during t...

AI Technical Summary

Problems solved by technology

The glass glue 13 inside the hole-digging area 11 cannot be subjected to the reflected laser light of the metal block 121 on both sides and the bottom layer and the inorganic protective layer 122 covered therewith, while the glass glue 13 in the metal area 12 can be subjected to the reflected laser light of the bottom metal block 121, thereby The temperature of the glass glue in the hole-digging area is slightly lower than that in other areas, so there is a difference in the laser si

Images