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Photocoupler

A technology of optical coupling device and light receiving element, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of increasing the size of the installed circuit board, and achieve the effect of reducing the size

Inactive Publication Date: 2015-09-16
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the size of the mounted circuit board increases, and electronic equipment such as semiconductor testers increases in size

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0024] figure 1 (a) is a schematic sectional view of the optical coupling device according to the first embodiment, figure 1 (b) is a schematic plan view of a mounting substrate provided with a conductive pattern on an insulating substrate.

[0025] The optical coupling device has an insulating substrate 10 , an input terminal 20 , an output terminal 30 , a (first) lower pad portion 41 , a light receiving element 60 , and a light emitting element 50 .

[0026] figure 1 (a) is along figure 1 A schematic sectional view of line A1-A2 of (b). The insulating substrate 10 has a first layer 10a and a second layer 10b, the lower surface of the first layer 10a is defined as a first surface 10c, and the upper surface of the second layer 10b is defined as a second surface 10d. A plurality of through holes are provided on the insulating substrate 10 .

[0027] The input terminal 20 has a first terminal 21 and a second terminal 22 . The first terminal 21 has: a first conductive regio...

no. 2 approach

[0045] Figure 5 (a) is a schematic sectional view of the optical coupling device according to the second embodiment, Figure 5 (b) is a schematic plan view of a mounting substrate provided with a conductive pattern on an insulating substrate.

[0046] The optical coupling device has an insulating substrate 10 , an input terminal 20 , an output terminal 30 , an underlayment portion 41 , a light receiving element 60 , and a light emitting element 50 .

[0047] The insulating substrate 10 has a first layer 10a, a second layer 10b, and a third layer 10c. The lower surface of the first layer 10a is a first surface 10c, and the upper surface of the second layer 10b is a second surface 10d. A plurality of through holes are provided on the insulating substrate 10 .

[0048] The first spiral conductive region 201 is disposed between the first layer 10a and the third layer 10c, and is respectively connected to the first conductive region 21a and the second conductive region 21b of th...

no. 3 approach

[0053] Figure 7 (a) is a schematic perspective view of an optical coupling device according to a third embodiment, Figure 7 (b) is a schematic sectional view, Figure 7 (c) is a schematic plan view before molding the sealing resin layer.

[0054] The optical coupling device has an insulating substrate 10 , an input terminal 20 , an output terminal 30 , a first underlayment portion 41 , a second underlayment portion 40 , a light receiving element 60 , a resistor 90 , a light emitting element 50 and a MOSFET 70 . also, Figure 7 (b) is a schematic cross-sectional view along line A2-A2.

[0055] The insulating substrate 10 has a first face 10a and a second face 10b. The input terminal 20 has a first terminal 21 and a second terminal 22 . The first terminal 21 has a first conductive region 21a provided on the first face 10a and a second conductive region 21b provided on the second face 10b. The second terminal 22 has a first conductive region 22a disposed on the first face...

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Abstract

The invention provides a photocoupler which can reduce the size of an external installation substrate. The photocoupler includes: an insulating substrate; an input terminal; an output terminal; a die pad part; a light emitting element; and a light receiving element. The insulating substrate includes a first layer, a second layer and a plurality of through holes. The input terminal includes a first terminal and a second terminal. The first terminal includes a first conductive region, a second conductive region, a through conductive region in the through holes, and a first spiral conductive region. The second terminal includes a first conductive region, a second conductive region, a through conductive region in the through holes, and a second spiral conductive region. The light receiving element is bonded to the die pad part and connected to the output terminal. The light emitting element is bonded to an upper surface of the light receiving element. The light emitting element has a first electrode connected with the second conductive region of the first terminal and a second electrode connected with the second conductive region of the second terminal.

Description

[0001] References to related applications [0002] This application is based on and claims priority from prior Japanese Patent Application No. 2014-052666 filed on March 14, 2014, the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments of the present invention relate to an optical coupling device. Background technique [0004] Optical coupling devices, including photocouplers or photorelays, can use light-emitting elements to convert input electrical signals into optical signals, and output electrical signals after receiving light with light-receiving elements. Therefore, the photocoupler can transmit electrical signals in a state of isolation between input and output. [0005] In electronic devices such as semiconductor testers, there are many cases where different power supply systems such as a DC voltage system, an AC power supply system, a telephone line system, and a control system are arranged in one device. However, if...

Claims

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Application Information

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IPC IPC(8): H01L31/08
CPCH01L2224/48091H01L2224/48227H01L2224/73265H01L2924/13091H01L2924/181H01L2924/00012H01L2924/00014H01L2924/00
Inventor 鹰居直也伊藤阳一郎
Owner KK TOSHIBA
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