Transport systems, reaction chambers and semiconductor processing equipment

A technology of a reaction chamber and a transmission system, applied in the field of semiconductor processing, can solve the problems of easy occurrence of eddy current, poor process quality, easy diffusion, etc., and achieve the effects of improving uniformity, improving yield, and improving process quality
CN104934353BActive Publication Date: 2018-01-19BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Publication Date
2018-01-19

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Abstract

The invention provides a conveying system, a reaction chamber and semiconductor processing equipment. The conveying system comprises a conveying device and a gate. The conveying device is provided with a conveying channel which is communicated with the reaction chamber. The conveying channel is used as the channel for conveying processed workpieces into or out of the reaction chamber. The gate is used for opening or closing the conveying channel. The gate is arranged at the end, which is communicated with the reaction chamber, of the conveying channel. Furthermore the gate opens or closes the conveying channel in an overturning manner. The conveying system provided by the invention can prevent diffusion of process gas into the conveying channel, thereby preventing an eddy phenomenon of the process gas at the central area of the reaction chamber caused by flow speed reduction, improving distribution uniformity of the process gas in the reaction chamber and furthermore improving process quality.
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Description

technical field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a transmission system, a reaction chamber and semiconductor processing equipment. Background technique

[0002] Silicon epitaxial equipment is used to produce silicon epitaxial wafers. Its working principle is as follows: transport silicon compounds to high temperature (>1100°C) substrates, and use hydrogen (H 2 ) to precipitate silicon on the substrate through a reduction reaction. In practical applications, in order to prevent the external environment from affecting the internal environment of the reaction chamber, thereby affecting the process quality, the reaction chamber is usually sealed during the process.

[0003] figure 1 It is a schematic structural diagram of an existing silicon epitaxial equipment. figure 2 for figure 1 The left side view of the silicon epitaxial equipment is shown. Please also refer to figure 1 and figure 2 , ...

Claims

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