Method for preventing short circuit of anode frame by sticking thin teflon film
A polytetrafluoroethylene and anode frame technology, which is applied in the field of DC magnetron sputtering deposition of thin films, can solve problems such as abnormal stop and inability to start the process, and achieve the effects of improving yield, equipment utilization, and product yield.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0014] Specific implementation mode one: combine figure 1 and figure 2 Explain that a method for preventing short circuit of the anode frame by bonding polytetrafluoroethylene sheets described in this embodiment is achieved through the following steps:
[0015] Step 1: Determine the bonding area: the periphery of the anode frame 1 is fixed on the upper end of the target base 2 by bolts, and the bonding area 3 of the polytetrafluoroethylene sheet is set on the inner side of the anode frame 1 and is located on the target base 2 inside;
[0016] Step 2: Bonding PTFE sheets: Cut the PTFE sheets according to the shape of the bonding area 3, and bond the cut PTFE sheets with high-temperature-resistant adhesive or high-temperature-resistant double-sided tape On the bonding area 3 on the anode frame 1 .
[0017] In the DC magnetron sputtering process, the upper end of the target base 2 is provided with an insulating layer 4, the insulating layer 4 is usually a polytetrafluoroethyl...
specific Embodiment approach 2
[0020] Specific implementation mode two: combination figure 1 and figure 2 Note that in step 2 of this embodiment, the thickness of the polytetrafluoroethylene sheet is 100 μm to 500 μm. Other method steps are the same as those in the first embodiment.
[0021] In order to ensure the insulation effect, the thickness of the polytetrafluoroethylene sheet is 100 μm to 500 μm. In addition, a certain thickness of polytetrafluoroethylene coating can be attached to the anode frame 1 to replace the polytetrafluoroethylene sheet, or other high temperature resistant insulator materials can be used instead PTFE.
specific Embodiment approach 3
[0022] Specific implementation mode three: combination figure 1 and figure 2 Note that in the second step of this embodiment, the high temperature resistant glue is high temperature resistant silica gel. Other method steps are the same as those in the first embodiment.
[0023] Dow Corning 736 organic silica gel can be used as the high temperature resistant adhesive, and You DY4589 from Shanghai can be used as the preferred high temperature resistant double sided tape. on bonding area 3.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More