Liquid droplet discharge head substrate and method of manufacturing liquid droplet discharge head
A manufacturing method and head substrate technology, applied in the field of liquid droplet discharge head manufacturing, capable of solving problems such as affecting discharge characteristics, clogging of adhesives, high probability, etc.
Active Publication Date: 2017-05-24
KONICA MINOLTA INC
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, bonding using an adhesive may cause the openings provided on the plate to be clogged with the adhesive, which may affect the discharge characteristics.
Especially in the droplet ejection head substrate having openings such as nozzle holes and flow paths formed in a high density, it is highly likely to
Method used
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[0045] First, the droplet discharge head and the liquid droplet discharge head substrate of the present invention will be described.
[0046] figure 1 It is an exploded perspective view of the droplet discharge head of the present invention. figure 2 to represent figure 1 A partial cross-sectional view of the layer structure of the droplet discharge head substrate 2 in the shown droplet discharge head.
[0047] Below, combine figure 1 and figure 2 Be explained.
[0048] exist figure 1 Among them, 1 is a droplet discharge head, and the droplet discharge head 1 includes a droplet discharge head substrate 2 , a holding substrate 3 , an external wiring member 4 , and an ink channel member 5 .
[0049] The droplet ejection head substrate 2 is constituted by laminating and integrating three substrates of a nozzle plate 21 (first plate), an intermediate plate 22 (second plate), and a main body plate 23 (third plate).
[0050] The nozzle plate 21 is composed of a Si substrate...
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Provided is a bonding method that allows bonding to be performed while maintaining high ejection performance without damaging the nozzle holes in a method for producing a droplet ejection head substrate by bonding stacked chips. It includes: a first step of subjecting the bonding surfaces of the first to second plates to surface activation treatment; and a second step of aligning and stacking the first to second plates so that the first to second plates are stacked. The plurality of nozzle holes formed on the plate and the plurality of through holes formed on the second plate communicate with each other; and a third step is to connect the stacked first plates using atomic bonds that are not accompanied by covalent bonds caused by ion movement. 1. The bonding surfaces of the second plate are joined, and the third step is to contact a load at a position that avoids the plurality of nozzle holes from the surface of the first plate on the droplet discharge side under atmospheric pressure. While pressing, the bonding surfaces are brought close to each other by the electrostatic attraction force generated between the bonding surfaces, and the bonding is performed.
Description
technical field [0001] The present invention relates to a droplet discharge head substrate that discharges liquid from nozzle holes, and a method of manufacturing the droplet discharge head. Background technique [0002] In recent years, in printing equipment such as printers and film-forming devices used in the manufacture of semiconductor devices, the so-called technology of discharging and ejecting droplets of ink and film-forming materials used in the film-forming devices onto objects is used. Droplet discharge technology. [0003] In such liquid droplet discharge technology, since it is desired to improve the printing quality and film formation accuracy, it is also desirable for the liquid droplet discharge head used in the liquid droplet discharge technology to have a device capable of landing even finer liquid on the target with high precision. Such discharge characteristics. In addition, it is desired to provide a liquid droplet discharge head in which nozzles for ...
Claims
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IPC IPC(8): B41J2/16B41J2/045B41J2/055
CPCB41J2/161B41J2/1623B41J2/16
Inventor 香西洋明
Owner KONICA MINOLTA INC