Heat exchanger and method for manufacturing same

Abstract

According to the present invention, the manufacturing process is simplified, the weight and cost are reduced, and a safe and reliable structure is obtained, using a generic metal plate. This heat exchanger has outer surfaces (4a, 5a) positioned on the side toward the electronic component (3) that is the object of heat exchange, and resin-coated inner surfaces (4b, 5b). A thin metal plate having a predetermined thickness is press-worked to a predetermined shape and a first shaped body (4) and a second shaped body (5) are formed. The two shaped bodies are combined so that the inner surface (4b, 5b)-sides face each other, and the inner surface (4b) at the edge parts (4c) and the inner surface (5b) at the edge parts (5c) are thermally fused by heat press-working. The edge parts (4c, 5c) are subjected to ultra-fine processing and then inserted into a die, and a thermoplastic resin composition is injected into the cavity of the die and a joining member (6) is shaped. The space section (7) created by the combining has a feed port (10) and an outlet port (11), and represents a fluid channel for a heat medium (8). The heat exchanger (1) is imparted with the structure described above. The outer surfaces (4a, 5a) are brought into contact with the electronic component (3) and heat exchange is performed with the heat medium flowing through the fluid channel.

Description

technical field [0001] The invention relates to a heat exchanger for exchanging heat via a heat medium and a manufacturing method thereof. More specifically, it relates to a heat exchanger for cooling by exchanging heat with electronic components and the like of an electronic control circuit, and a method for manufacturing the same. Background technique [0002] Regarding heat exchangers that efficiently transfer heat from objects to objects, heat exchangers for heating, cooling, and heat exchangers of various structures have been proposed and widely used in various fields. In particular, cooling equipment for electronic components is equipped with a cooler because semiconductor elements such as a central processing unit (CPU) mounted on a board of a control circuit generate high generated heat and need to be cooled. For example, electronic components in automobile-related fields that use air-cooled or water-cooled coolers are often exposed to harsh environments such as ope...

AI Technical Summary

Problems solved by technology

[0008] Welding related to automobiles is difficult in terms of reliability. Therefore, although various measures have been taken to withstand severe conditions in the past, and corresponding proposals have been made, it is difficult to say that it is a perfect proposal.

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