Wafer Soaker

Abstract

The invention belongs to the field of wafer wet processing in the semiconductor industry, and specifically relates to a wafer soaking device that meets the needs of wafer soaking. One end of the connecting rod is connected to the output end of the electric actuator, and the other end is inserted into the liquid storage tank and hinged with the cassette; the tank wall at the upper part of the liquid storage tank is provided with a transfer window for the manipulator to send the wafer into the cassette; The electric actuator drives the lifting link to drive the film box up and down, so that the film box rises to the height corresponding to the film transfer window to pick up / put the wafer, or makes the film box descend to immerse the wafer under the chemical liquid; the upper and lower two sides inside the film transfer window The air blowing pipes installed on the liquid storage tank are respectively arranged on the sides, the air blowing pipes are connected with the air source, and a plurality of air nozzles are evenly distributed on each air blowing pipe. The invention realizes the uniformity of the soaking time of a single chip and the waiting time after taking it out, and realizes higher requirements on wafer soaking in the wet processing process.

Description

technical field [0001] The invention belongs to the field of wafer wet processing in the semiconductor industry, in particular to a wafer soaking device meeting the wafer soaking requirements. Background technique [0002] At present, the wafer wet processing process in the semiconductor industry often requires the use of chemical liquid to soak the wafer. The current wafer soaking method generally uses the whole box of wafers to be soaked in the chemical liquid tank at the same time, and then the whole box is taken out for the next process after the predetermined time; The wafers are processed sequentially, which results in a different waiting time for each piece of the whole box of wafers, which may affect the quality of the final chip. Therefore, how to achieve the uniformity of soaking time for each wafer is an inevitable problem. Contents of the invention [0003] In order to solve the uniformity of the soaking time of a single wafer and the waiting time after takin...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the uniformity of the soaking time of a single wafer and the waiting time after taking it out during the wafer soaking process, the main purpose of the present invention is to provide a wafer soaking device that can transfer wafers in time-sharing and meet higher requirements for wafer soaking

Images