High integration density 8*8 microwave switch matrix based on LTCC technology

Abstract

Provided is a high integration density 8*8 microwave switch matrix based on the LTCC technology. The switch matrix is a multilayer planar structure, and is formed by integrating a radio frequency network, a power supply network and a single-pole eight-throw switch on a multilayer LTCC substrate, aiming to solve the problem of high integration density of a microwave switch matrix. According to the invention, an LTCC medium substrate is provided with 8*8 switch matrix radio frequency routing and power supply networks; the effective transmission of radio frequency signals among different layers is realized through a vertical interconnection design; the interconnection between a radio frequency network and the single-pole eight-throw switch is realized through the gold wire and gold belt bonding technology; the switching states of a radio frequency channel are controlled through software operation of a host computer. The switch matrix has a compact whole design structure, and can substantially shrink the size of an 8*8 switch matrix, and significantly reduce the insertion loss of the radio frequency channel.

Description

technical field [0001] The invention relates to a highly integrated 8x8 switch matrix based on LTCC technology, in particular to a highly integrated 8x8 switch matrix based on an LTCC substrate, which belongs to the technical field of microwave circuits. Background technique [0002] With the continuous development of satellite technology, satellite payload products continue to develop in the direction of miniaturization and light weight, and the highly integrated design of satellite-borne stand-alone products is the basis for realizing this goal. Microwave switch matrices are often used in communication, radar and other satellites. The design method in this patent can realize the miniaturization and weight reduction of the microwave switch matrix. [0003] The on-board microwave switch matrix includes radio frequency circuit, control circuit and power network. The radio frequency circuit components can switch channels in response to the control commands sent by the host com...

AI Technical Summary

Problems solved by technology

Improve the switch matrix of the traditional three-dimensional assembly structure into a multi-layer planar structure, integrate the radio frequency network, power supply network, and single-pole eight-throw switch that make up the switch matrix on a multi-layer LTCC substrate, and focus on solving the high integration of microwave switch matrix The problem

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