igto package structure
A packaging structure and ring structure technology, applied in the direction of output power conversion devices, electrical components, etc., can solve the problems of waveform distortion and noise, increase in volume and weight, and reduce efficiency, and achieve large connection contact area, which is conducive to heat conduction, Good cooling effect
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[0024] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0025] The IGTO packaging structure proposed by the present invention includes a GTO device 1, a driving circuit board 2, a conductive substrate 3 and a protective cover 4;
[0026] GTO device 1 such as figure 2 As shown, it is generally in the shape of a round cake, including a ceramic insulating shell 101. The anode 102 of the GTO device is in the middle of the top of the insulating shell 101 and serves as the anode of the IGTO device; the outer surface of the insulating shell 101 of the GTO device is provided with two The upper and lower ring structures are spaced apart, the last ring structure is the gate electrode ring 103 of the GTO device, and the next ring structure is the cathode ring 104 of the GTO device; figure 1 The marks 103 and 104 in the GTO are the gate and cathode of GTO; while the traditional GTO gate lead wire is a copper wire of 4 square ...
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