igto package structure

A packaging structure and ring structure technology, applied in the direction of output power conversion devices, electrical components, etc., can solve the problems of waveform distortion and noise, increase in volume and weight, and reduce efficiency, and achieve large connection contact area, which is conducive to heat conduction, Good cooling effect

Active Publication Date: 2017-07-14
WUXI TONGFANG MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This requires the addition of commutation circuits, which not only increases the volume and weight of the equipment, but also reduces efficiency and generates waveform distortion and noise

Method used

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0025] The IGTO packaging structure proposed by the present invention includes a GTO device 1, a driving circuit board 2, a conductive substrate 3 and a protective cover 4;

[0026] GTO device 1 such as figure 2 As shown, it is generally in the shape of a round cake, including a ceramic insulating shell 101. The anode 102 of the GTO device is in the middle of the top of the insulating shell 101 and serves as the anode of the IGTO device; the outer surface of the insulating shell 101 of the GTO device is provided with two The upper and lower ring structures are spaced apart, the last ring structure is the gate electrode ring 103 of the GTO device, and the next ring structure is the cathode ring 104 of the GTO device; figure 1 The marks 103 and 104 in the GTO are the gate and cathode of GTO; while the traditional GTO gate lead wire is a copper wire of 4 square ...

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PUM

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Abstract

The invention provides an IGTO packaging structure, including a GTO device and a drive circuit board. The GTO device includes an insulating case, and the anode of the GTO device is also used as the anode of the IGTO device in the middle of the top of the insulating case; There are two annular structures spaced up and down on the outer surface, the upper annular structure is the gate electrode ring of the GTO device, and the lower annular structure is the cathode ring of the GTO device; the cathode ring of the GTO device is discontinuous and has at least one gap; Part of the cathode ring of the GTO device is inserted into the mounting hole on the drive circuit board through the gap, and then rotated so that the GTO device is inserted into the mounting hole of the drive circuit board, and the cathode ring and gate ring of the GTO device are respectively located on the drive circuit board. On the reverse side and the front side of the board, the gate electrode ring and the cathode ring of the GTO device are respectively closely contacted and electrically connected to the first electrical connection areas on the front and back sides of the drive circuit board. The lead wire of the invention has small inductance, good heat dissipation performance, and is convenient for crimping and use.

Description

technical field [0001] The invention relates to an electronic device packaging structure, in particular to an IGTO device packaging structure. Background technique [0002] Turn-off thyristor GTO (Gate Turn-Off Thyristor) is also known as gate-controlled thyristor. After the ordinary thyristor (SCR) is triggered by the positive signal of the gate, it can maintain the on state even if the signal is removed. To turn it off, the power supply must be cut off so that the forward current is lower than the holding current, or a reverse voltage is applied to close it. This requires the addition of a commutation circuit, which not only increases the volume and weight of the device, but also reduces efficiency and generates waveform distortion and noise. The turn-off thyristor (GTO) overcomes the above defects. It not only retains the advantages of ordinary thyristors such as high withstand voltage and large current, but also has self-shutoff capability, so it is more convenient to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/08
Inventor 潘烨白玉明张海涛
Owner WUXI TONGFANG MICROELECTRONICS
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