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High-speed photocuring 3D printing device and printing method

A 3D printing and photo-curing technology, applied in the field of 3D printing, can solve the problems of limiting 3D printing speed and achieve the effects of improving fluidity, continuous lifting, and increasing printing speed

Active Publication Date: 2015-11-04
苏州智能制造研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is these two reasons that limit the 3D printing speed of light curing

Method used

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  • High-speed photocuring 3D printing device and printing method
  • High-speed photocuring 3D printing device and printing method
  • High-speed photocuring 3D printing device and printing method

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Experimental program
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Embodiment Construction

[0036] The present invention will be further described below in conjunction with the drawings and implementation process.

[0037] Such as figure 1 , figure 2As shown, the structure of the high-speed light-curing 3D printing device of the present invention is as follows: a liquid photosensitive resin 10 is housed in the liquid pool 4, and a light-transmitting glass plate 8 is arranged at the bottom of the liquid pool 4, and the upper side of the glass plate 8 is coated with Anti-adhesive coating 7, pipeline liquid outlet 5 and pipeline liquid inlet 6 are respectively installed at a certain distance from both sides of printing platform 9, pipeline liquid outlet 5 and pipeline liquid inlet 6 pass through the side wall of liquid pool 4 and are on the outside Connected by pipe 3. The pipeline 3 is connected with a pump 2 that drives the liquid to pump the liquid photosensitive resin 10 in the pipeline from one side of the pump inlet to the other side of the pump outlet. The mot...

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Abstract

The invention discloses a high-speed photocuring 3D printing device and method. The device comprises a liquid pool filled with liquid photosensitive resin, a printing platform and a radiation source. A transparent plate corresponding to the printing platform and the radiation source is arranged at the bottom of the liquid pool. The side, facing the printing platform, of the transparent plate is covered with a transparent anti-bonding coating. The device further comprises a liquid outlet and a liquid inlet which are formed in the side wall of the liquid pool, a pipeline connecting the liquid outlet and the liquid inlet, and a drive unit which is arranged on the pipeline and used for driving the liquid photosensitive resin to flow among the liquid outlet, the liquid inlet and the pipeline. A curing window is coated with the transparent anti-bonding coating, and therefore the problem that the curing photosensitive resin is bonded and attached to a glass plate due to excessively fast laser radiation is avoided. Pipelines promoting flowing of the liquid photosensitive resin are arranged on the two sides of a printing area, the mobility of the photosensitive resin near the printing area is improved, supplementing of the photosensitive resin is accelerated, and rapid printing of the SLA is achieved.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a high-speed photocuring 3D printing device and a printing method. Background technique [0002] Rapid prototyping (RP) technology is an advanced manufacturing technology developed in the 1990s. It is a key common technology for the development of new products for manufacturing companies. Power has a positive impetus. [0003] SLA (Stereo Lithography Appearance, Stereo Lithography Appearance) is the earliest practical rapid prototyping technology, using liquid photosensitive resin raw materials. The process is to firstly design a three-dimensional solid model through CAD, use a discrete program to slice the model, and design the scanning path. The generated data will precisely control the movement of the laser scanner and the lifting table; the laser beam is scanned by the numerical control device. The device irradiates the surface of the liquid photosensitive resin accordi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C67/00B33Y30/00B33Y10/00
Inventor 贺永谢超淇傅建中沈洪垚
Owner 苏州智能制造研究院有限公司
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