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A high-speed light-curing 3D printing device and printing method

A 3D printing and light curing technology, applied in the field of 3D printing, can solve problems such as limiting the speed of 3D printing, and achieve the effect of improving fluidity, increasing printing speed and continuous lifting

Active Publication Date: 2017-10-13
苏州永沁泉智能设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is these two reasons that limit the 3D printing speed of light curing

Method used

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  • A high-speed light-curing 3D printing device and printing method
  • A high-speed light-curing 3D printing device and printing method
  • A high-speed light-curing 3D printing device and printing method

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Experimental program
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Embodiment Construction

[0036] The present invention will be further described below in conjunction with the drawings and implementation process.

[0037] Such as figure 1 , figure 2As shown, the structure of the high-speed light-curing 3D printing device of the present invention is as follows: a liquid photosensitive resin 10 is housed in the liquid pool 4, and a light-transmitting glass plate 8 is arranged at the bottom of the liquid pool 4, and the upper side of the glass plate 8 is coated with Anti-adhesive coating 7, pipeline liquid outlet 5 and pipeline liquid inlet 6 are respectively installed at a certain distance from both sides of printing platform 9, pipeline liquid outlet 5 and pipeline liquid inlet 6 pass through the side wall of liquid pool 4 and are on the outside Connected by pipe 3. The pipeline 3 is connected with a pump 2 that drives the liquid to pump the liquid photosensitive resin 10 in the pipeline from one side of the pump inlet to the other side of the pump outlet. The mot...

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Abstract

The invention discloses a high-speed light-curing 3D printing device and method, wherein the device includes a liquid pool filled with liquid photosensitive resin, a printing platform and an irradiation light source, and the bottom of the liquid pool is provided with a corresponding to the printing platform and the irradiation light source. A transparent plate, the side of the transparent plate facing the printing platform is covered with a transparent anti-adhesive coating; it also includes: a liquid outlet and a liquid inlet arranged on the side wall of the liquid pool; a pipeline connecting the liquid outlet and the liquid inlet; A drive unit is arranged on the pipeline for driving the liquid photosensitive resin to circulate between the liquid outlet, the liquid inlet and the pipeline. The invention avoids the problem that the cured photosensitive resin sticks to the glass plate caused by too fast laser irradiation by coating the transparent anti-adhesive coating on the curing window. There are pipes on both sides of the printing area to promote the flow of liquid photosensitive resin, which improves the fluidity of the photosensitive resin near the printing area, accelerates the replenishment of photosensitive resin, and realizes the rapid printing of SLA.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a high-speed photocuring 3D printing device and a printing method. Background technique [0002] Rapid prototyping (RP) technology is an advanced manufacturing technology developed in the 1990s. It is a key common technology for the development of new products for manufacturing companies. Power has a positive impetus. [0003] SLA (Stereo Lithography Appearance, Stereo Lithography Appearance) is the earliest practical rapid prototyping technology, using liquid photosensitive resin raw materials. The process is to firstly design a three-dimensional solid model through CAD, use a discrete program to slice the model, and design the scanning path. The generated data will precisely control the movement of the laser scanner and the lifting table; the laser beam is scanned by the numerical control device. The device irradiates the surface of the liquid photosensitive resin accordi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/124B29C64/245B33Y30/00B33Y10/00
Inventor 贺永谢超淇傅建中沈洪垚
Owner 苏州永沁泉智能设备有限公司
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