Solder composition and method for preparing solder
A composition and solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems such as residual residue, unbearable tension, general connection performance, etc.
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[0018] The present invention also provides a method for preparing solder, wherein the preparation method includes mixing zinc, copper, lead, aluminum, manganese, iron and indium and then melting; wherein,
[0019] Relative to 100 parts by weight of the zinc, the amount of the copper is 10-30 parts by weight, the amount of the lead is 50-100 parts by weight, the amount of the aluminum is 10-50 parts by weight, and the amount of the manganese The amount used is 1-10 parts by weight, the amount of iron used is 1-5 parts by weight, and the amount of indium used is 0.1-1 parts by weight.
[0020] Similarly, in order to make the prepared solder composition have better welding performance and less residual residue in actual use, in a preferred embodiment of the present invention, relative to 100 parts by weight of the zinc , the consumption of the copper is 15-20 parts by weight, the consumption of the lead is 60-80 parts by weight, the consumption of the aluminum is 30-40 parts by w...
Embodiment 1
[0026] 100g of zinc, 15g of copper, 60g of lead, 30g of aluminum, 5g of manganese, 2g of iron, 0.3g of indium and 0.1g of silver were mixed and ground to a particle size of 0.2mm, and then smelted in a melting furnace at a temperature of 800°C to produce Solder A1 is obtained.
Embodiment 2
[0028] 100g of zinc, 20g of copper, 80g of lead, 40g of aluminum, 7g of manganese, 4g of iron, 0.7g of indium and 0.5g of silver were mixed and ground to a particle size of 0.2mm, and then smelted in a melting furnace at a temperature of 1600°C. Solder A2 is obtained.
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Abstract
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