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Solder composition and method for preparing solder

A composition and solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems such as residual residue, unbearable tension, general connection performance, etc.

Active Publication Date: 2017-12-05
百色市龙浩新材料制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the above-mentioned prior art, the purpose of the present invention is to overcome the problem that although the welding materials in the prior art can be connected to a certain extent, the connection performance during connection is often general and cannot bear large pulling force. Afterwards, it is easy to leave a lot of residues, thereby providing a method for preparing solder compositions and solders that can effectively solder, make the connection performance of the solder joints good, and have less residue after soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0018] The present invention also provides a method for preparing solder, wherein the preparation method includes mixing zinc, copper, lead, aluminum, manganese, iron and indium and then melting; wherein,

[0019] Relative to 100 parts by weight of the zinc, the amount of the copper is 10-30 parts by weight, the amount of the lead is 50-100 parts by weight, the amount of the aluminum is 10-50 parts by weight, and the amount of the manganese The amount used is 1-10 parts by weight, the amount of iron used is 1-5 parts by weight, and the amount of indium used is 0.1-1 parts by weight.

[0020] Similarly, in order to make the prepared solder composition have better welding performance and less residual residue in actual use, in a preferred embodiment of the present invention, relative to 100 parts by weight of the zinc , the consumption of the copper is 15-20 parts by weight, the consumption of the lead is 60-80 parts by weight, the consumption of the aluminum is 30-40 parts by w...

Embodiment 1

[0026] 100g of zinc, 15g of copper, 60g of lead, 30g of aluminum, 5g of manganese, 2g of iron, 0.3g of indium and 0.1g of silver were mixed and ground to a particle size of 0.2mm, and then smelted in a melting furnace at a temperature of 800°C to produce Solder A1 is obtained.

Embodiment 2

[0028] 100g of zinc, 20g of copper, 80g of lead, 40g of aluminum, 7g of manganese, 4g of iron, 0.7g of indium and 0.5g of silver were mixed and ground to a particle size of 0.2mm, and then smelted in a melting furnace at a temperature of 1600°C. Solder A2 is obtained.

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PUM

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Abstract

The invention discloses a solder composition and a preparation method for solder. The composition comprises, by weight, 100 parts of zinc, 10-30 parts of copper, 50-100 parts of lead, 10-50 parts of aluminum, 1-10 parts of manganese, 1-5 parts of iron and 0.1-1 part of indium. According to the design, the solder prepared from the components has the good welding effect in actual use, the residual quantity of residues can be greatly reduced in actual use, therefore, the using efficiency is improved, and pollution to environment is greatly reduced.

Description

technical field [0001] The invention relates to the field of production and preparation of solder materials, in particular to a solder composition and a solder preparation method. Background technique [0002] In daily production and life, many parts are connected by welding, and the quality of welding performance often depends largely on the quality of welding materials. Although the welding materials in the prior art can be connected to a certain extent, the connection performance is generally average during connection and cannot bear a large tensile force. At the same time, most solders tend to have many residues after welding. [0003] Therefore, it is an urgent problem to be solved in the present invention to provide a solder composition and a solder preparation method that can be effectively soldered so that the connection performance of the solder joint is good and the amount of residue after soldering is small. Contents of the invention [0004] For the above-ment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/28B23K35/40
CPCB23K35/282B23K35/40
Inventor 冯晓丹曾燕琼谢露红
Owner 百色市龙浩新材料制造有限公司