Glass substrate lithography alignment apparatus and aligning method characterized by no positioning marks
A glass substrate and photolithographic alignment technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of maximizing the effective use area, high-precision photolithographic alignment, and accurate positioning
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[0043] The present invention provides a set of photoetching masks for photoetching exposure of the positioning tool and the semi-cylindrical glass substrate. In the photolithography method provided in the implementation of the present invention, firstly, a high-precision positioning tool is designed and manufactured to firmly adsorb the substrate during photolithographic exposure of the semi-cylindrical glass substrate. The key dimensions of the tooling are measured, and a set of masks (total of two) are designed according to them. Use one of the masks to make a cross mark on the surface of the tooling by photolithography, and then use the cross mark to align with the cross mark on the other mask, and finally achieve a half without any positioning mark on the surface. The requirements for the alignment accuracy of the lithography of the cylindrical glass substrate are specifically that the deviation (eccentricity) between the center line of the lithographic slit on the plane of...
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