All-round-light LED light source and preparation method thereof

Abstract

The invention provides an all-round-light LED light source and a preparation method thereof. The all-round-light LED light source comprises a pin support which is composed of a plane body and two pins; LED chips; and a wavelength conversion part. The LED chips are fixed on the plane body of the pin support via welding conductive wires and packaged in the wavelength conversion part together with the plane body. The two pins of the pin support stretch out of the wavelength conversion part and are respectively connected with the positive and negative electrodes of a power supply. According to the all-round-light LED light source, the whole LED chips are packaged in the wavelength conversion part to realize 360-degree all-round-light light emission so that the structure is simple. Meanwhile, the structure of the wavelength conversion part is improved and the size of the wavelength conversion part is increased, especially when multiple chips are packaged together, so that precision is easy to control in the manufacturing process, and color temperature consistency can be enhanced. The preparation method is simple, quality control is easy, product precision is great, color temperature is uniform and consistency can be enhanced.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a full-circumference LED light source and a preparation method thereof. Background technique [0002] LED light-emitting diodes have been recognized globally as the most efficient artificial lighting technology. It has the advantages of long life and low energy consumption. In the field of general lighting, the trend of using LEDs to replace traditional light-emitting devices is gradually emerging. [0003] However, most of the current LED light sources have directional self-illumination, such as figure 1 As shown, the existing LED light source packaging structure is as follows, including LED chip 1', bracket 2', wavelength conversion part 3', light-transmitting part 4', LED chip 1' is installed in the middle of the upper surface of bracket 2', LED chip 1 ' is covered with a wavelength conversion part 3', and the light emitted by the LED chip 1' can excite the wavelength conversion part 3' ...

AI Technical Summary

Problems solved by technology

[0004] Since the wavelength conversion part 3' only covers the upper surface of the LED chip 1', the emitted light after excitation and conversion is directional, and even after being diffused by the light-transmitting part 4', the light distribution angle is generally below 120° , the back where the light cannot reach, will form a dark shadow

[0005] Moreover, since the wavelength conversion layer 3' usually exists in the form of a film or a sheet, the thickness is relatively thin, and the volume is small. During the preparation process, due to the inconsistent specific gravity and properties of materials such as phosphors and colloids, sedimentation and uneven dispersion are prone to occur. Phenomenon, resulting in poor product consistency, the same batch of packaged light sources, the color temperature deviation is large, it is difficult to control

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