The invention belongs to the technical field of
semiconductor packaging, and particularly relates to an efficient
welding method for
semiconductor packaging. The efficient
welding method comprises thesteps of according to the number of
welding wires of a product, selecting a multi-purpose spool, a multi-hole threading
pipe, a multi-head wire conduit and a multi-welding-wire-groove
chopper which match one another; carrying out multi-purpose spool fixing and welding wire conveying; welding a welding wire on the
chip; forming a line arc; and carrying out frame pin welding. By means of the welding method, multiple welding wires can be welded to a
single product at a time, and the wire welding operation efficiency is improved extremely efficiently. By means of the welding method, when multiplewelding wires are welded at a time, gaps and spaces reserved in a traditional welding mode can be avoided, and higher
design space is brought to the design of a
chip pressure area. The original chippressure area can contain the welding wires with the larger wire
diameter, and the requirement for higher breakover current is met.