Reduced friction lift pin

Abstract

A substrate support is provided that features a lift pin having at least one larger diameter shoulder section that forms a relief region between the lift pin and a guide hole disposed through a substrate support. The shoulder section minimizes contact between the substrate support and lift pin guide hole, thereby reducing pin scratching, particle generation, component wear, and increasing the useful life of the pin. In another embodiment, a flat-bottom tip is provided to promote self-standing of the lift pin, reducing pin tilting or leaning of the lift pin within the guide hole.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation of U.S. patent application Ser. No. 10 / 241,005, filed Sep. 10, 2002, which issued May 3, 2005 as U.S. Pat. No. 6,887,317.FIELD OF THE INVENTION [0002] The present invention relates generally to an apparatus for semiconductor processing. More specifically, the invention relates to a lift pin utilized for spacing substrates from a substrate support. BACKGROUND OF THE INVENTION [0003] Integrated circuits have evolved into complex devices that include millions of transistors, capacitors and resistors on a single chip. The evolution of chip design results in faster circuitry and greater circuit density. As the demand for integrated circuits continues to rise, chip manufactures have demanded semiconductor process tooling having increased wafer throughput, greater product yield, and more robust processing equipment. To meet demands, tooling is being developed to minimize particle contamination and increase th...

AI Technical Summary

Benefits of technology

[0007] An improved lift pin design for spacing a substrate from a substrate support is provided. The lift pin features at least one larger diameter shoulder section that forms a relief region between the pin and a guide hole disposed through a substrate support. The shoulder section minimizes contact between the substrate support and lift pin guide hole, thereby reducing pin scratching, particle generation, component wear, and increasing the useful life of the pin. In another embodiment, a flat-bottom tip is provided to promote self-standing of the lift pin, reducing pin tilting or leaning of the lift pin within the guide hole.

Problems solved by technology

Integrated circuits have evolved into complex devices that include millions of transistors, capacitors and resistors on a single chip.

One problem that has been observed in the prior art is particle generation attributed to contact between the lift pins and the guide holes as the lift pins move through the substrate support.

Specifically, contact of the sides of the lift pin with the bottom edge of the guide hole may cause deep scratches over the entire length of the lift pin.

Additionally, as the scratched pin repeatedly passes through the guide holes of the substrate support, the lift pin becomes more susceptible to binding and galling, resulting in shortened lift pin service life.

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