Efficient welding method for semiconductor packaging

Abstract

The invention belongs to the technical field of semiconductor packaging, and particularly relates to an efficient welding method for semiconductor packaging. The efficient welding method comprises thesteps of according to the number of welding wires of a product, selecting a multi-purpose spool, a multi-hole threading pipe, a multi-head wire conduit and a multi-welding-wire-groove chopper which match one another; carrying out multi-purpose spool fixing and welding wire conveying; welding a welding wire on the chip; forming a line arc; and carrying out frame pin welding. By means of the welding method, multiple welding wires can be welded to a single product at a time, and the wire welding operation efficiency is improved extremely efficiently. By means of the welding method, when multiplewelding wires are welded at a time, gaps and spaces reserved in a traditional welding mode can be avoided, and higher design space is brought to the design of a chip pressure area. The original chippressure area can contain the welding wires with the larger wire diameter, and the requirement for higher breakover current is met.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor packaging, and specifically relates to an efficient welding method for semiconductor packaging. Background technique [0002] The welding wire of the ultrasonic bonding process at room temperature can be welded with aluminum wire, aluminum strip, copper wire or other alloy materials. Because these materials have good performance and strength, they are more and more widely used in power device packaging in recent years. With the continuous development of society, power semiconductor devices capable of carrying higher power have been widely used in the fields of telecommunication server power supply, induction heating applications, uninterruptible power supplies, mobile phones, automotive electronics, plasma TVs, LCD TVs and other fields. With the development of power devices in the direction of high power, high frequency, and integration, terminal products have higher and higher requirements for c...

AI Technical Summary

Problems solved by technology

[0004] The traditional ultrasonic bonding process adopts the welding method of single welding single welding wire, so that a single product needs multiple ultrasonic welding to complete the repeated welding of two or more welding wires on a single product, which will reduce the ultrasonic bonding operation. At the same time, limited by the structural characteristics of the rivet and the wire conduit, after the first welding wire is welded, if the distance between the welding point position of the second welding wire and the welding point position of the first welding wire is too narrow, the rivet or The wire tube will touch the welding spot or arc of the first welding wire, which will not only affect the welding and arc drawing of the second welding wire, but also cause damage to the welding spot and arc of the first welding wire, so two or more A certain spacing and space need to be reserved in the process of root wire welding and arc formation, which brings certain process restrictions to chip structure design and packaging design.

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