Dry etching equipment and method thereof

Abstract

The invention discloses a set of dry etching equipment which comprises an etching chamber and an air exhausting system that is arranged at the bottom of the etching chamber. The air exhausting system comprises the components of: an air exhausting channel which is provided with a plurality of air exhausting openings and air discharging openings, an air exhauster, and controllable valves which are respectively mounted on each air exhausting openings. The invention further discloses a dry etching method which comprises the following steps: placing a workpiece to be etched into a base station in the etching chamber; selecting an air exhausting mode according to a step to be performed, wherein the air exhausting modes comprises a circulating operation mode and a non-circulating operation mode; and performing the dry etching step when air exhausting is performing according to the circulating operation mode or the non-circulating operation mode. The dry etching equipment according to the invention has functions of: further improving homogeneity of the dry etching process, improving homogeneity in manufacture of an array substrate, improving product quality and yield rate, reducing restriction of process homogeneity to product design, and improving product design space.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a dry etching device and method. Background technique [0002] With the development of the information society, people's demand for display devices has increased, which has also promoted the rapid development of the LCD panel industry, and the output of panels has continued to increase. The etching process is an important step in the process of manufacturing a Thin Firm Transistor Liquid Crystal Display (TFT-LCD for short) array substrate. The etching process is divided into a dry etching process and a wet etching process according to the physical state of the etchant, that is, the dry etching process is an etching process using an etching gas, and the wet etching process is an etching process using an etching liquid. [0003] In the process of TFT-LCD manufacturing by dry etching process, ideally the etching gas is completely perpendicular to the The direction of the su...

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Problems solved by technology

[0006] Aiming at the problem that the uniformity of the dry etching process in the prior art is not high enough, the present invention provides a dry etching equipment, including:

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