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2results about How to "Reduce Design Constraints" patented technology

Test case execution method and device, equipment and medium

The invention relates to the technical field of automatic testing, and discloses a test case execution method and device, equipment and a medium, and the method comprises the steps: obtaining a target test case for testing a test object, and carrying out instruction framework matching on any test step in the target test case to obtain an instruction information framework of any test step; performing test parameter query according to the instruction information framework, and performing test instruction assembly according to a query result of the test parameter query to obtain a test execution instruction for executing any test step; and testing the test object based on the test execution instruction to obtain test result data of the test object based on any test step. The method has the beneficial effects that the test parameters used for testing are inquired by utilizing the instruction information framework matched with the target test case, so that the complete test execution instruction is assembled and used for testing, decoupling management of the test case and the test parameters is realized, and the expandability and universality of the test case are improved.
Owner:SHANGGUANG COMM TECH (SHANGHAI) CO LTD

Circuit board and method of manufacturing the same

PendingCN122438256AReduce Design Constraints
The present disclosure provides a circuit board and a manufacturing method thereof. The circuit board includes an insulating layer having a via hole extending through the insulating layer in a first direction, a through hole filling the via hole and including a hollow portion extending through the through hole in the first direction, a plunger filling the hollow portion of the through hole, and a circuit layer disposed on the insulating layer and the through hole. The through hole includes a through portion extending in the first direction and an extension portion extending from the through portion in a direction perpendicular to the first direction and disposed on the insulating layer. The circuit layer includes a pad disposed on the extension portion and a circuit wiring disposed on the insulating layer.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD