Inspection device for solder joints between leads and devices

Abstract

The invention discloses a verification apparatus of a solder point between a lead wire and a device, for detecting the insulation effect of an insulation layer arranged on the solder point. The apparatus comprises a power supply connected with the lead wire and a flexible conductor covering the insulation layer. The power supply, the lead wire, the flexible conductor and one indication lamp are connected in series through the lead wire to form a current loop; when the solder point is exposed out of the insulation layer and is in contact with the flexible conductor, the current loop is conducted, and the indication lamp is lighted; and when the solder point and the flexible conductor are completely isolated by the insulation layer, the current loop is broken, and the indication lamp is not lighted. According to the invention, the verification apparatus is simple in structure, determines whether a solder point exposure condition exists through determining whether the indication lamp works or not under the condition that the power supply is connected, in simple in verification operation, and can effectively prevent the situation that the device is short-circuited due to exposure of the solder point out of the insulation layer.

Description

technical field [0001] The invention belongs to the technical field of lead type device packaging, and in particular relates to an inspection device for solder joints between lead wires and devices. Background technique [0002] Conventional leaded devices, such as motors, earpieces and speakers, etc., are first produced by the body, and then the lead is welded to a connected mechanism or device on the body. This mechanism or device communicates with the internal circuit of the body, for example For PCB board, FPC, etc. In order to protect the solder joints, a protective insulating layer must be added outside the solder joints. On the one hand, it prevents the solder joints from being damaged, and on the other hand, it also prevents the solder joints from being short-circuited with external mechanisms or devices, because the installation position of the lead-type device is around All conductive metals. Such as figure 1 with figure 2 As shown, the device 1 is installed o...

AI Technical Summary

Problems solved by technology

like figure 1 and figure 2 As shown, the device 1 is installed on the magnesium-aluminum alloy 4 of the front case 2. Once the solder joint 3 is exposed, it will be connected with the magnesium-aluminum alloy 4 of the front case 2 and cause a short circuit, which will cause the device 1 to be weak; especially when doing some imitation user When using the test, such as falling from a height of 10mm, it will repeat the fall many times when imitating the long-term use of the user. After multiple vibrations, the device may be in a different position from the original assembly

In addition, the solder joint itself is a hard material and cannot be bent. If there is no insulation protection or the protection is not in place, the lead wire may be pulled up during operation, directly stressing the position of the solder joint, or even breaking it.

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