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Wafer processing method and intermediate member

A technology of intermediate parts and processing methods, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve problems such as increased difficulty, chip paste protection parts, paste or adhesive residue, etc.

Active Publication Date: 2015-11-25
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, it is difficult to peel the wafer from the protective tape or the protective member of WSS without breaking it. It is more difficult to break
In addition, there is also the problem that paste or adhesive remains on the surface of the device after the wafer is peeled off from the protective member.
[0010] In particular, on a wafer with a plurality of bumps formed on each device, not only is it difficult to attach the wafer to the protective member flatly due to the unevenness of the bumps, but there is also a problem that paste or adhesive remains between the bumps.

Method used

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  • Wafer processing method and intermediate member
  • Wafer processing method and intermediate member
  • Wafer processing method and intermediate member

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Embodiment Construction

[0028] Embodiments of the present invention will be described in detail below with reference to the drawings. refer to figure 1 , shows a perspective view of a semiconductor wafer (hereinafter sometimes simply referred to as "wafer") 11 suitable for processing by the processing method of the present invention.

[0029] The semiconductor wafer 11 has a front surface 11a and a back surface 11b. On the surface 11a, a plurality of streets (planned dividing lines) 13 are formed orthogonally, and devices 15 are formed in respective regions divided by the streets 13 . The semiconductor wafer 11 is composed of, for example, a silicon wafer with a thickness of 700 μm.

[0030] like figure 1 As shown in the enlarged view of , a plurality of protruding bumps 17 are formed on the four sides of each device 15 . Because the bumps 17 are formed on the four sides of each device 15, the semiconductor wafer 11 has: a central region (bump formation region) 19 in which the bumps 17 are formed;...

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Abstract

The invention provides a wafer processing method and an intermediate member, which can prevent paste or adhesive among bumps when a protective component is stripped and can easily strip off the protective device. The front face of a wafer is provided with a central area in which are disposed a plurality of components, each component formed with a plurality of projections, and a peripheral edge region surrounding the central region. The processing method includes: an intermediate member preparation step of preparing an intermediate member which includes a flexible member that corresponds to the central region of the wafer, and an adhesive member arranged on the peripheral edge of the flexible member; an adhering step for adhering the intermediate member to a support plate by the adhesive member and for adhering the wafer to the intermediate member on the support plate by the adhesive member in a state in which the central region of the wafer with the flexible element is in contact; and a grinding step of grinding the backside of the wafer; and a stripping step for stripping the wafer from the support plate.

Description

technical field [0001] The present invention relates to a processing method of a wafer, each device of which has a plurality of bumps, and an intermediate part used in the processing method. Background technique [0002] A large number of devices such as IC (Integrated Circuit: integrated circuit) and LSI (large scale integration: large scale integrated circuit) are formed on the surface of the semiconductor wafer, and each device is divided by a plurality of dividing lines (separation lanes) formed in a grid shape After the back surface of the semiconductor wafer is ground by a grinding device to a predetermined thickness, it is cut along the planned dividing line by a cutting device (Dicing (scribing) device) and divided into individual devices. Devices are widely used in various electronic devices such as mobile phones and computers. [0003] A grinding apparatus for grinding the back surface of a wafer has: a chuck table holding a wafer; A grinding tool for grinding wa...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67132H01L21/6835H01L2221/68327H01L21/6836H01L2221/6834H01L2221/68381H01L2221/6839H01L21/78H01L21/304H01L21/02024
Inventor 卡尔·普利瓦西尔
Owner DISCO CORP
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