Scraper structure and glue application method

Abstract

The invention discloses a scraper structure and a glue application method. The scraper structure comprises a body and a head. One end of the body is provided with a fastening handle, and the other end thereof is provided with the head. The width of the section of the head gradually decreases. In the glue application method, the head and a printing plate form an entry angle 10-40 degrees and a separating angle 10-40 degrees. In the scraper structure and the glue application method, the head of the scraper is designed a manner wherein the width of the section gradually decreases, so that the bottom of the scraper forms small gathering entry angle and separating angle 10-30 degrees, glue scraping and glue coating processes are smooth and meet hydromechanics principle, scraping thickness non-uniformity and bubbles caused by abrupt changes in sectional area of relative motion of the scraper and glue in conventional metal stencil printing are decreased, printing success rate and controllability are improved, printing quality can be improved, glue waste can be decreased, printing resistance is decreased, and production process convenience is improved.

Description

technical field [0001] The invention relates to a heat-conducting glue coating device, in particular to a scraper structure and a glue-coating method for coating heat-conducting glue on heating components or heat-dissipating devices. Background technique [0002] LED chips, communication devices, electronic chips, etc. generate a lot of heat during operation, so it is necessary to apply thermal conductive glue on the back to form a good heat transfer path, so as to avoid premature failure or even burning of the devices when they heat up. Liquid or gel-like thermally conductive adhesives include thermally conductive silicone pastes that do not undergo curing reactions, thermally conductive adhesives that undergo addition reactions or condensation reactions, and the like. Such as Dow Corning TC4025 (two-component), SE4485, EA9189, 1-4173, etc., the viscosity value ranges from tens of thousands to hundreds of thousands of mPa·S. [0003] High thermal conductivity glue has more...

AI Technical Summary

Problems solved by technology

[0003] High thermal conductivity glue has more fillers, the weight ratio reaches 50-90%, the viscosity is relatively high, the rheology is poor, and the adhesion to the printing surface is not good

The conventional printing process uses stainless steel sheets or hard plastics of uniform thickness, and the construction angle of attack is 45-75°, which is easy to deform during construction, resulting in uneven thickness of the printed thermal conductive adhesive, and easy to generate air bubbles, etc., and during construction Squeegee is easy to deform, affecting the stability and controllability of printing quality

However, the price of the solidified thermal pad is relatively high, and requires secondary processing to cut into special-shaped features, resulting in a serious waste of materials

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