124results about How to "Improve the detachment effect" patented technology

A throwaway insert and a cutting tool enable a high speed cutting operation for a metallic material having great ductility such as aluminum and obtaining a vertical wall with a high quality machined surface while improving chip control. The throwaway insert (1) comprises a major cutting edge (60) including a tapered cutting edge (61) connected to a cutting edge (41) of a nose portion (40), and a curved cutting edge (62) connected to an end of the tapered cutting edge (61) at a connection point (P). The curved cutting edge (62) is formed so as to extend along an imaginary cylindrical surface (S) whose center axis coincides with the axis of rotation of a tool main body (200), and tapered cutting edge (61) is formed so as to gradually curve from the imaginary cylindrical surface (S) toward the inside of the imaginary cylindrical surface (S) as the distance from the curved cutting edge (62) increases, and the distance from the nose portion (40) decreases. The throwaway insert (1) is attached to the tool main body (200) in which the surface of the distal end thereof is machined so that surface roughness thereof is less than 3.2 mu m when indicated by the Ry roughness. <IMAGE>A throwaway insert and a cutting tool enable a high speed cutting operation for a metallic material having great ductility such as aluminum and obtaining a vertical wall with a high quality machined surface while improving chip control. The throwaway insert (1) comprises a major cutting edge (60) including a tapered cutting edge (61) connected to a cutting edge (41) of a nose portion (40), and a curved cutting edge (62) connected to an end of the tapered cutting edge (61) at a connection point (P). The curved cutting edge (62) is formed so as to extend along an imaginary cylindrical surface (S) whose center axis coincides with the axis of rotation of a tool main body (200), and tapered cutting edge (61) is formed so as to gradually curve from the imaginary cylindrical surface (S) toward the inside of the imaginary cylindrical surface (S) as the distance from the curved cutting edge (62) increases, and the distance from the nose portion (40) decreases. The throwaway insert (1) is attached to the tool main body (200) in which the surface of the distal end thereof is machined so that surface roughness thereof is less than 3.2 mu m when indicated by the Ry roughness. <IMAGE>

In a hybrid car, or an electric motor-driven four-wheel-drive vehicle, in which an electric motor is driven directly by an output from a generator, vehicle running performance is enhanced. The output from the generator is controlled so as to maintain a generator torque in a range, in which the vehicle does not stall. Specifically, a driving apparatus for the hybrid car includes a second generator 2 driven by an engine 1 for driving one pair of either front or rear wheels 14, 15 , an electric motor 5 driven through directly receiving the output from the second generator 2 and driving the other pair of either the front or rear wheels 14, 15 , and a four-wheel-drive control unit 6 controlling driving of the second generator 2 and the electric motor 5 . When the engine 1 is in an overloaded condition, the four-wheel-drive control unit 6 limits the output of the second generator 2.

An epoxy resin composition for semiconductor encapsulation which is for use in the resin encapsulation of semiconductor elements other than optical semiconductor elements including photoreceptors and light-emitting elements. This epoxy resin composition comprises the following ingredients (A) to (D) and has a content of ingredient (D) of 75-95% by weight based on the whole epoxy resin composition: (A) an epoxy resin, (B) a phenolic resin, (C) a specific release agent, and (D) an inorganic filler. The epoxy resin composition for semiconductor encapsulation which has improved adhesive force in application to metallic frame parts / heat radiation plates and can be inhibited from suffering separation from metallic frame parts / heat radiation plates during molding.

There are provided an endless belt having a structure containing at least three layers, a middle layer being disposed between the outermost layer and a bottom layer, and the middle layer being composed of a material having a thermal decomposition temperature lower than the deposition temperature of each of the outermost layer and the bottom layer, and provided a method for manufacturing the endless belt. There are provided an endless belt having high surface resistivity, an excellent toner releasing property, an excellent non-contaminated property, stable volume resistivity, excellent adhesion between a surface layer and an elastic layer, and the like without the occurrence of disadvantageous bleeding of a contaminant, and a method for manufacturing the endless belt.

In a method for separating wafers from a support device (17), wherein the wafers are formed by sawing a wafer block (40) fastened to the support device (17) by way of adhesives, and wherein the wafers themselves are still adhering on one side, the support device (17) with the wafers is driven along a constant plane of motion into an adhesive removal device (47). The support device remains therein and is enclosed in an adhesive removal basin (55, 55a, 55b) by moveable wall parts (52a, 52b). After forming and closing the adhesive removal basin (55, 55a, 55b), solvent for removing the adhesive is placed in the adhesive removal basin and onto the wafers for dissolving the adhesive and then removing the wafers from the support device (17).